Semiconductor News & Analysis Feed
73 articles
2026-07-17
digitimes.com
2026-07-17
TSMC Chairman C.C. Wei formally announced on July 16 that the company will invest an additional US$100 billion in the US, funding several 2nm and more advanced logic wafer fabs as well as advanced packaging plants to support continued strong demand from major US customers.
2026-07-15
tomshardware.com
2026-07-15
Etiido Uko
Intel is using ASML’s High-NA EUV tools to pattern select Panther Lake layers, marking the technology’s first use in high-volume logic production
2026-07-15
www.tomshardware.com
2026-07-15
Tom's Hardware
2026-07-15
www.techtimes.com
2026-07-15
Tech Times
2026-07-15
www.techtimes.com
2026-07-15
Tech Times
2026-07-15
thequantuminsider.com
2026-07-15
The Quantum Insider
2026-07-15
www.tradingview.com
2026-07-15
TradingView
2026-07-15
www.manilatimes.net
2026-07-15
The Manila Times
2026-07-15
www.marketscreener.com
2026-07-15
marketscreener.com
2026-07-15
finance.yahoo.com
2026-07-15
Yahoo Finance
2026-07-15
www.lincolnjournal.com
2026-07-15
lincolnjournal.com
2026-07-15
digitimes.com
2026-07-15
Major cloud service providers (CSPs) have front-loaded purchases of future DRAM capacity, and the global memory supply-demand gap is expected to last through 2027. Powerchip Semiconductor Manufacturing (PSMC) said on a July 14, 2026, online earnings call that it raised DRAM wafer start prices in July by about 45% from June, with the increase expected to flow into revenue and profit from November,
2026-07-15
digitimes.com
2026-07-15
Dutch lithography giant ASML reported total net sales of EUR9.3 billion for the second quarter of 2026, exceeding its own guidance, as customers accelerated capacity expansion plans amid continued AI-driven demand for advanced logic and memory chips.
2026-07-15
digitimes.com
2026-07-15
ASML confirmed on July 15 that Intel Foundry has become the first company in the industry to ship a high-volume logic product manufactured using High-NA EUV lithography, marking a significant milestone in the commercial readiness of the Dutch equipment maker's most advanced lithography technology.
2026-07-14
digitimes.com
2026-07-14
As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the most advanced models. It is increasingly shaped by who can secure compute, deploy infrastructure at scale, reduce energy constraints, and turn research into commercial capability.
2026-07-14
digitimes.com
2026-07-14
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.
2026-07-14
news.google.com
2026-07-14
digitimes
2026-07-14
news.google.com
2026-07-14
NVIDIA Developer
2026-07-13
news.google.com
2026-07-13
santoandre.biz
2026-07-12
www.indexbox.io
2026-07-12
IndexBox