SemiPulse — Semiconductor Intelligence

Lam Research launches PLP Center of Excellence, replacing wafers with panels

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digitimes.com 2026-05-22

Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng

AP Memory IPD enters Intel's EMIB supply chain, shipments set for 2Q26

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digitimes.com 2026-05-22

Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products, also known as discrete silicon capacitors (IPD), will begin small-volume shipments in the second quarter of 2026, making it the first supplier qualified for Intel's embedded multi-die interconnect bridge (EMIB) advanced

Nvidia characterizes LPX as niche silicon optimized for high-speed premium tokens

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digitimes.com 2026-05-22

Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads. The hardware targets a narrow segment of service providers that operate premium, high-velocity token applications for select customer bases. While the architecture excels at rapid text decoding, its broader market

Infineon Breaks Past Analyst Consensus as Asian Roadshow Targets Design Wins - AD HOC NEWS

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www.ad-hoc-news.de 2026-05-21 AD HOC NEWS

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How Nvidia Uses AI To Accelerate Chip Design (NASDAQ:NVDA) - Seeking Alpha

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seekingalpha.com 2026-05-21 Seeking Alpha

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Micron Posts Permanent Seoul HBM Design Roles, Targeting Samsung Engineers as Strike Resolves - Tech Times

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www.techtimes.com 2026-05-21 Tech Times

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Micron Posts Permanent Seoul HBM Design Roles, Targeting Samsung Engineers as Strike Resolves - Tech Times

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www.techtimes.com 2026-05-21 Tech Times

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Rathbones Group PLC Has $192.72 Million Stock Position in Cadence Design Systems, Inc. $CDNS - MarketBeat

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www.marketbeat.com 2026-05-21 MarketBeat

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PNC Financial Services Group Inc. Boosts Position in Cadence Design Systems, Inc. $CDNS - MarketBeat

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news.google.com 2026-05-21 MarketBeat

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EUV Mask Challenges: Curvilinear Design, Data Volume, and Inspection Bottlenecks in 2026 - News and Statistics - IndexBox

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www.indexbox.io 2026-05-21 IndexBox

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Synopsys Benefits From AI-Driven Chip Design Demand - Let's Data Science

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letsdatascience.com 2026-05-21 Let's Data Science

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Scaling the Next Generation of Multi-Die Systems

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eetimes.com 2026-05-21

This year’s EE Times Chiplets event will address challenges in the design flow and chiplet technologies to enable straightforward scaling.

Chiplets Multi-die Systems Advanced Packaging EDA Tools AI Infrastructure Interconnect Technology Chip Design System Integration

Infineon CoolGaN BDS 40V G3 Cuts Portable Power Design Footprint by Up to 82% - TimesTech

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timestech.in 2026-05-21 TimesTech

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Cadence Design (CDNS) Gets a Buy from Mizuho Securities - The Globe and Mail

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news.google.com 2026-05-21 The Globe and Mail

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The Bull Case For Cadence Design Systems (CDNS) Could Change Following AI-Fueled Backlog And Aeva LiDAR IP Win - simplywall.st

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simplywall.st 2026-05-21 simplywall.st

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Synopsys stock (US8716071076): strong quarter and AI design boom keep focus on growth - AD HOC NEWS

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www.ad-hoc-news.de 2026-05-21 AD HOC NEWS

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Demand surge for power semiconductors reshapes data-center power and cooling, pushing suppliers toward SiC and GaN

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digitimes.com 2026-05-21

Demand for power components is surging as AI servers adopt high-voltage direct current power delivery and advanced cooling technologies. This shift could increase component density and design complexity across the data center supply chain. Taiwanese power semiconductor makers are moving into cooling and power-management MOS technologies, as well as higher-spec upgrades.

Low-Temp Solders Are Suddenly Critical For Chiplets And Photonics

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semiengineering.com 2026-05-21 Laura Peters

Warpage, heat, and brittleness can cause huge reliability problems for expensive designs.

Low-temperature solders Chip packaging Silicon photonics Thermomigration Electromigration SAC305 Sn-Bi alloy Lead-free solder

Cadence Design Systems (NASDAQ:CDNS) VP Sells $369,559.26 in Stock - MarketBeat

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news.google.com 2026-05-21 MarketBeat

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Cadence Design Systems Inc (CDNS) Shares Surge 3.8% -- What GF S - GuruFocus

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www.gurufocus.com 2026-05-21 GuruFocus

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