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The rapid evolution of intelligent software-defined systems is pushing chip design into a new era of physical AI, one where chip design complexity is outpacing traditional engineering methods. Manufacturers are racing to cram hundreds of billions of transistors into components that power everything from autonomous vehicles to hyperscale data centers. As a result, designing silicon has become extr

SK Hynix is recruiting engineers in San Jose to co-design 3D stacked DRAM-on-logic with US customers, extending its custom memory strategy beyond high-bandwidth memory and toward on-device AI applications.

AI performance comes down to three dimensions:  Accuracy: How well the model reasons and produces outputs Throughput: How many tokens per second a datacenter can generate  Interactivity: How responsive the model feels to a user, dominated by latency  Deployments must balance all three: High accuracy is wasted if responses are slow, and raw throughput means little if each user’s experience is lag

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