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20 articles
Trending Companies
NVIDIA8 TSMC7 Micron7 Infineon Technologies6 Synopsys5 Intel5 SK hynix4 Nvidia4 AMD4 MediaTek3 Qualcomm3 Cadence3
Trending Technologies
Advanced Packaging8 GPU7 HBM6 AI6 EDA6 Data Center Infrastructure4 AI Compute3 Semiconductor Manufacturing3 NAND Flash3 2.5D/3D Packaging3 AI Chips3 DRAM3
2026-09-29
Samsung nears 60% 2nm yield, targets big tech with power gains - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-29
2026-09-28
Tsmc adds five Chiayi packaging plants as AI demand surges, builds Taichung hub - CHOSUNBIZ - Chosunbiz
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news.google.com 2026-09-28
2026-09-28
SK hynix validates HBM5 with TSMC, wins partner of year again - CHOSUNBIZ - Chosunbiz
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news.google.com 2026-09-28
2026-09-23
Taiwan pairs TSMC and MediaTek to outpace South Korea in chip design - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-23
2026-09-23
Kiwoom sees Samsung miss Q3 profit but bets on HBM and foundry growth - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-23
2026-09-23
Qualcomm debuts 2nm Snapdragon 8 Elite chips, drives agentic AI on phones - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-23
2026-09-22
Malaysia draws AI packaging investment as Korea’s HBM exports surge fivefold - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-22
The surge in Korea's HBM-related exports to Malaysia—up 466.6% year-over-year to $1.62 billion in August 2026—signals a structural shift in the global advanced packaging supply chain. Rather than a simple capacity overflow from TSMC's CoWoS fabs in Taiwan, this trend reflects a deeper realignment: A
Advanced PackagingHBMHBM4AI ChipsBack-end SemiconductorMalaysiaKorea ExportsSamsung Electronics
2026-09-22
Daishin Securities sees Samsung strengthen upcycle on demand and HBM gains - CHOSUNBIZ - Chosunbiz
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news.google.com 2026-09-22
2026-09-17
TSMC extends 2nm lead as MediaTek orders pressure Samsung and Qualcomm - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-17
2026-09-15
Kioxia eyes US ADR listing to raise over $10B amid chip market volatility - CHOSUNBIZ - biz.chosun.com
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biz.chosun.com 2026-09-15
2026-09-11
CXMT rides DDR5 surge to lead operating margins amid HBM-driven DRAM squeeze - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-11
2026-09-11
Apple debuts 2nm A20 Pro as Qualcomm readies rival, costs squeeze consumers - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-11
Apple unveiled its first 2-nanometer mobile application processor, the A20 Pro, on September 9, 2026, powering the iPhone 18 Pro, Pro Max, and Apple's first foldable phone. The chip delivers a 20% performance boost in CPU and up to 40% in GPU, with dedicated AI compute units enhancing on-device Gene
AppleQualcomm2nm processMobile processorArtificial IntelligenceChip designSemiconductor manufacturingTSMC
2026-09-09
DLSS5 drives GPU and memory prices higher as HBM focus tightens supply - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-09
2026-09-08
OpenAI’s Astra reignites AI race, lifts Korea chip stocks despite HBM worries - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-08
2026-09-08
Samsung applies high NA EUV to DRAM by 2028, deepens ASML partnership - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-08
2026-09-08
Synopsys unifies EDA and multiphysics with Ansys to drive agentic AI in Korea - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-08
2026-09-03
Samsung narrows HBM gap as SK hynix leads global market - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-03
According to market research firm Counterpoint Research, Samsung Electronics significantly increased its global high bandwidth memory (HBM) market share in Q2 2026, reaching 33%, up 12 percentage points from 21% in Q1. Despite this, SK Hynix retained the top spot with 50%, down 8 points from Q1’s 58
High Bandwidth MemoryHBMSemiconductor MarketSamsung ElectronicsSK HynixMemory ChipMarket ShareTechnology Competition
2026-09-03
Zeiss says China trails EUV leaders by 15 years as export curbs reshape race - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-03
2026-09-02
Big tech pivot to Intel packaging as TSMC backlog grows; Korea diversifies - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-02
2026-09-01
China’s CXMT starts HBM3E production, targets domestic AI chips next year - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-09-01