Semiconductor News & Analysis Feed
85 articles
2026-06-10
www.bisinfotech.com
2026-06-10
Bisinfotech
www.bisinfotech.com
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2026-06-10
digitimes.com
2026-06-10
Samsung Electronics is considering building an advanced semiconductor packaging facility in the southwestern city of Gwangju, a move that would expand its backend chipmaking footprint as demand for high-bandwidth memory and AI-related chips grows.
2026-06-09
digitimes.com
2026-06-09
Yangtze Memory Technologies Co. (YMTC) is bringing its consumer SSD brand ZHITAI back to South Korea after a four-year absence, as major memory makers devote more resources to high-bandwidth memory and enterprise storage.
2026-06-09
digitimes.com
2026-06-09
Samsung Electronics' foundry business may return to profit as early as the third quarter of 2026, ahead of its previous target of late 2026 to 2027, as improving yields, larger orders, and stronger demand for high-bandwidth memory base dies lift utilization, according to Korean media reports.
2026-06-08
digitimes.com
2026-06-08
Apple's M5 Pro signals a broader shift in laptop processors, with implications for global device makers, developers, and AI users. A teardown suggests Apple is combining chiplet-style packaging, higher memory bandwidth, and GPU-based AI acceleration to strengthen on-device computing while reshaping how premium PCs approach local AI workloads.
2026-06-06
digitimes.com
2026-06-06
DRAM prices are climbing as Samsung Electronics, SK Hynix, and Micron Technology prioritize high-bandwidth memory, or HBM, for AI applications, tightening supply of mainstream DDR5 and DDR4 products used in PCs, servers, and other electronics, according to Nikkei.
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-27
wccftech.com
2026-05-27
Wccftech
FuriosaAI and Broadcom have partnered to build a high-performance AI accelerator chip featuring next-gen HBM4/E memory.
FuriosaAI has announced its third-generation AI accelerator, which builds upon its 2nd Generation RNGD platform, which is currently in mass production on TSMC's 5nm process technology. The 2nd Gen RNGD AI platform comes in the form of a 180W PCIe-based design, which aims at LLM
2026-05-27
digitimes.com
2026-05-27
SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for short-reach AI cluster links. The collaboration could accelerate the commercialization of Micro LED co-packaged optics (CPO) technology and strengthen China's role in global AI infrastructure supply chains, according to
2026-05-27
digitimes.com
2026-05-27
First Micron, then SK Hynix, join the trillion-dollar club, capping an extraordinary repricing of an industry once dismissed as a commodity play. The milestone is more than a valuation story: it crystallizes a structural debate about whether AI has permanently transformed memory's earnings profile, a bubble concern as Chinese rivals ramp capacity, and a sharpening geopolitical contest over who con
2026-05-27
digitimes.com
2026-05-27
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
2026-05-26
www.blocksandfiles.com
2026-05-26
Blocks & Files
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2026-05-26
digitimes.com
2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter to unveil its latest laser product, Guide DR. To advance its 3D-stacked silicon photonics engine, Lightmatter is also working closely with TSMC using its Compact Universal Photonic Engine (COUPE) platform.
2026-05-26
digitimes.com
2026-05-26
Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products.
2026-05-24
www.techtimes.com
2026-05-24
Tech Times
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2026-05-17
wccftech.com
2026-05-17
Wccftech
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2026-05-15
www.openpr.com
2026-05-15
openPR.com
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2026-05-15
www.tipranks.com
2026-05-15
TipRanks
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