Semiconductor News & Analysis Feed
85 articles
2026-06-25
wccftech.com
2026-06-25
Wccftech
Qualcomm is unveiling its breakthrough for the AI data center market called HBC (High-Bandwidth Compute), to break the memory wall.
At its Investors Day 2026, Qualcomm unveiled HBC under its Dragonfly brand, an innovative technology that aims to offer a major boost in memory capacity and bandwidth. The HBC architecture deploys a purpose-built & near-memory solution that bonds compute with boosted
2026-06-24
digitimes.com
2026-06-24
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources reported. According to ET News, the DRAM subcommittee completed its review, and the JEDEC board gave final approval, positioning the standard to influence AI semiconductor cost structures and substrate choices.
2026-06-24
digitimes.com
2026-06-24
Samsung Electronics is putting long-term memory supply agreements higher on its second-half agenda as demand from data centers broadens beyond high-bandwidth memory, or HBM, into server DRAM and storage products.
2026-06-23
digitimes.com
2026-06-23
SK Hynix's semiconductor production base in Cheongju, South Korea, has seen a string of accidents since 2026, prompting questions over whether its safety management system has gaps. The incidents have drawn scrutiny because many occurred after the M15X fab began operation, as the company ramped up production to meet surging high-bandwidth memory (HBM) demand.
2026-06-22
digitimes.com
2026-06-22
SK Hynix briefly overtook Samsung Electronics on June 22 to claim the top spot by common-share market capitalization on South Korea's KOSPI exchange, a milestone that reflects how high-bandwidth memory (HBM) has redefined the value of Korea's semiconductor industry.
2026-06-19
digitimes.com
2026-06-19
SK Hynix is reported to have held a private meeting with U.S. Deputy Secretary of State Allison Hooker, with industry sources speculating the discussions covered high-bandwidth memory cooperation with major U.S. technology firms and potential semiconductor investment expansion.
2026-06-18
digitimes.com
2026-06-18
SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks to strengthen its lead in high-bandwidth memory (HBM) and secure talent for the fast-changing AI semiconductor market. Industry watchers said the move reflects a greater focus on practical creativity and execution in the AI era rather than formal academic credentials.
2026-06-18
digitimes.com
2026-06-18
The AI wave is rapidly reshaping the global semiconductor supply chain, and that upheaval is opening a new growth chapter for Taiwan's LED industry. As Taiwan's LED makers move away from the price wars of the consumer market, Nvidia's push to upgrade AI transmission standards to 1.6T, 3.2T, and beyond is exposing the physical limits of copper wiring, making scale-up the first battlefield in the co
2026-06-18
digitimes.com
2026-06-18
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on schedule.
2026-06-16
sg.finance.yahoo.com
2026-06-16
Yahoo Finance Singapore
Micron Technology (MU) Skyrocketed on Explosive Demand For High-Bandwidth Memory
Soumya Eswaran
Tue, 16 June 2026 at 8:04 am GMT-7 3 min read
MU
-6.18%
Columbia Threadneedle Investments, an investment management company, released its first-quarter 2026 investor letter for the “Columbia Global Technology Growth Fund”. A copy of the letter is available to download here. In Q1 2026, the Fund’s insti
2026-06-16
uk.finance.yahoo.com
2026-06-16
Yahoo Finance UK
Micron Technology (MU) Skyrocketed on Explosive Demand For High-Bandwidth Memory
Soumya Eswaran
Tue, 16 June 2026 at 8:04 am GMT-7 3 min read
MU
-6.18%
Columbia Threadneedle Investments, an investment management company, released its first-quarter 2026 investor letter for the “Columbia Global Technology Growth Fund”. A copy of the letter is available to download here. In Q1 2026, the Fund’s insti
2026-06-16
www.mk.co.kr
2026-06-16
매일경제
사진 확대
Employees of KT's partner companies are packing set-top boxes. KT
As demand for high-bandwidth memory (HBM) for artificial intelligence (AI) servers has soared, the price of general-purpose memory in set-top boxes is also soaring. Accordingly, KT is the first telecommunications company to pay advance payments to its partners to stabilize the supply chain.
KT announced on the 16th that it re
2026-06-16
www.mk.co.kr
2026-06-16
매일경제
Preemptive response to a 7-fold jump in memory values
Set-top box costs also doubled
Funding first-time carrier materials purchases
"Prevent supply chain disruptions and stabilize supply chains"
사진 확대
The manufacturing site of KT's set-top box partner. KT
As demand for high-bandwidth memory (HBM) for artificial intelligence (AI) servers has soared, the price of general-purpose memory in set-top b
2026-06-16
digitimes.com
2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th
2026-06-16
wccftech.com
2026-06-16
Wccftech
The compact space inside smartphones makes it difficult to adopt High Bandwidth Memory (HBM), not to mention the thermal problem, but a rumor claims that Chinese smartphone brands have a custom-made Low Latency Wide DRAM (LLW) that adopts a similar integrated design as the aforementioned technology. While the design isn’t “true HBM,” it aims to resolve the performance bottleneck issue that LPDDR R
2026-06-15
www.ad-hoc-news.de
2026-06-15
AD HOC NEWS
Texas Instruments, US8825081040
Battery life and bandwidth: why Texas Instruments’ CC2652R7 stands out in IoT designs
15.06.2026 - 16:33:50 | ad-hoc-news.de
Texas Instruments’ CC2652R7 wireless microcontroller targets low-power IoT devices that need both long battery life and multi-protocol connectivity. What the chip offers, where it fits in TI’s portfolio, and how it links back to the TXN share
2026-06-15
digitimes.com
2026-06-15
South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new con
2026-06-13
digitimes.com
2026-06-13
SK Hynix is reviewing rare price increase requests from several tier-one equipment suppliers, a sign that the high-bandwidth memory boom is beginning to reshape pricing power in South Korea's semiconductor equipment supply chain.
2026-06-12
digitimes.com
2026-06-12
Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports.
2026-06-11
finance.yahoo.com
2026-06-11
Yahoo Finance
Applied Materials (AMAT) Is One Of the Best High-Bandwidth Memory Stocks To Buy
Jabran Kundi
Thu, June 11, 2026 at 6:32 AM PDT 2 min read
AMAT
+7.22%
Trade AMAT on Coinbase
Trading disclosure
Applied Materials, Inc. (NASDAQ:AMAT) is one of the 10 Best High-Bandwidth Memory (HBM4) Value Chain Stocks to Buy According to Hedge Funds. On June 4, Evercore ISI analyst Mark Lipacis reiterated a Buy rati