Semiconductor News & Analysis Feed
20 articles
2026-10-01
www.eletimes.ai
2026-10-01
Infineon's Bangkok backend facility represents a strategic pivot in the company's global manufacturing architecture, positioning Southeast Asia as a critical node in an increasingly fragmented supply chain. The decision to build a greenfield site rather than retrofit existing capacity signals a long
2026-10-01
www.manilatimes.net
2026-10-01
2026-10-01
www.marketscreener.com
2026-10-01
2026-10-01
www.tradingview.com
2026-10-01
2026-10-01
www.digitimes.com
2026-10-01
2026-10-01
2026-10-01
evertiq.com
2026-10-01
Infineon's Bangkok backend facility represents a strategic pivot in the company's global manufacturing architecture, extending its footprint into Southeast Asia beyond traditional Asian hubs. The modular design—starting with one of five planned modules—signals a demand-gated expansion philosophy rat
2026-10-01
www.marketscreener.com
2026-10-01
2026-10-01
www.tradingview.com
2026-10-01
2026-10-01
www.marketscreener.com
2026-10-01
2026-10-01
www.electronicsforyou.biz
2026-10-01
Infineon's $114 million Bangkok OSAT facility represents a calculated move to harden its supply chain against the growing fragmentation of global semiconductor logistics. Rather than chasing leading-edge front-end fabrication, the German power-semiconductor leader is investing in the often-overlooke
2026-10-01
www.bisinfotech.com
2026-10-01
2026-10-01
2026-09-07
www.thelec.net
2026-09-07
2026-08-31
news.google.com
2026-08-31
2026-08-19
finance.biggo.com
2026-08-19
2026-08-15
www.techtimes.com
2026-08-15
Samsung Electronics is reportedly considering relocating its conventional DRAM and NAND flash packaging and testing operations from South Korean facilities to Vietnam, in order to free up space for high-bandwidth memory (HBM) production. This move aims to increase HBM output to meet the growing dema
2026-08-14
www.digitimes.com
2026-08-14
Samsung Electronics is reportedly considering relocating general-purpose DRAM and NAND packaging and testing operations from its Korean facilities in Cheonan and Onyang to Vietnam. This strategic move aims to free up domestic backend capacity for high-bandwidth memory (HBM) production. HBM is critic
2026-08-14
2026-07-10
www.igorslab.de
2026-07-10
Intel has filed a patent for XBM (Cross-Batch Memory), a novel memory architecture designed as an alternative to conventional High Bandwidth Memory (HBM). This technology aims to address current limitations in AI accelerators such as bandwidth, packaging costs, and complexity. Unlike traditional HBM