Semiconductor News & Analysis Feed

3 articles
2026-07-15
digitimes.com 2026-07-15
CXMT is preparing China's largest chip-sector IPO of 2026, seeking up to US$4.3 billion to expand DRAM and HBM capacity, deepen vertical integration, and challenge Samsung Electronics, SK Hynix, and Micron Technology under rising AI demand and tighter US export controls.
2026-06-29
digitimes.com 2026-06-29
BYD plans to install its first in-house smart-driving chip in a Denza production model in 2027, marking a key step in the Chinese automaker's push to extend vertical integration from electrification into intelligent driving.
2026-06-18
digitimes.com 2026-06-18
Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.