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TSMC's new verification line in Kaohsiung marks a strategic move toward advanced packaging dominance, reflecting a broader industry shift beyond traditional process node scaling. As the semiconductor industry enters the post-Moore era, performance gains increasingly rely on system-level optimization

TSMC's establishment of a new verification line in Kaohsiung signals a strategic shift toward advanced packaging dominance, reflecting the semiconductor industry's move beyond traditional process scaling. This initiative aims to integrate suppliers more closely with production needs, offering a test