57 articles
2026-05-23
finance.yahoo.com
2026-05-23
Yahoo Finance
__fail__
2026-05-23
finance.yahoo.com
2026-05-23
Yahoo Finance
__fail__
2026-05-22
digitimes.com
2026-05-22
BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.
2026-05-22
digitimes.com
2026-05-22
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng
2026-05-21
www.manufacturingdive.com
2026-05-21
Manufacturing Dive
__fail__
2026-05-21
www.cnbc.com
2026-05-21
CNBC
__fail__
2026-05-21
datacenterrichness.substack.com
2026-05-21
Data Center Richness | Substack
__fail__
2026-05-21
www.moomoo.com
2026-05-21
Moomoo
__fail__
2026-05-21
news.futunn.com
2026-05-21
富途牛牛
__fail__
2026-05-21
digitimes.com
2026-05-21
The US Department of Commerce (DOC) has reportedly issued "is-informed" letters to several major wafer fab equipment (WFE) manufacturers, ordering an immediate halt to tool shipments destined for Hua Hong Semiconductor, China's second-largest foundry. The restrictions specifically target two facilities within the Hua Hong Group, including its subsidiary Huali Microelectronics, which US officials b
2026-05-21
digitimes.com
2026-05-21
AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used in high-end CPUs, GPUs, ASICs, and networking chips.
2026-05-21
digitimes.com
2026-05-21
Advanced Micro Devices (AMD) CEO Lisa Su stated that the company plans to invest more than US$10 billion in Taiwan's industrial ecosystem to accelerate the development of artificial intelligence (AI) infrastructure. The announcement was made during her visit to Taiwan, where she also disclosed the latest progress in collaborations with Taiwan Semiconductor Manufacturing Company (TSMC), backend pac
2026-05-21
digitimes.com
2026-05-21
LG Innotek has secured substrate supply terms with major technology customers that increasingly resemble long-term agreements used in the memory-chip sector, boosting the South Korean supplier's revenue visibility and reducing profit volatility, according to reports.Hankyungand Yonhap, citing a KB Securities report, said the proposed contracts include large upfront payments, binding multi-year sup
2026-05-20
www.msn.com
2026-05-20
MSN
__fail__
2026-05-20
seekingalpha.com
2026-05-20
Seeking Alpha
__fail__
2026-05-20
www.ad-hoc-news.de
2026-05-20
AD HOC NEWS
__fail__
2026-05-20
www.investing.com
2026-05-20
Investing.com
__fail__
2026-05-20
www.trendforce.com
2026-05-20
TrendForce
__fail__
2026-05-20
digitimes.com
2026-05-20
Alibaba Cloud has unveiled the Zhenwu M890, a new proprietary AI training and inference chip developed by its semiconductor subsidiary T-Head Semiconductor, as the Chinese cloud group accelerates its push into full-stack AI infrastructure for the agentic AI era.
2026-05-18
digitimes.com
2026-05-18
Nan Ya PCB, one of Taiwan's leading IC substrate manufacturers, said it expects capital spending to rebound sharply in 2026, potentially reaching a record high, as demand from advanced chip packaging customers accelerates alongside the rapid growth of artificial intelligence (AI) computing.