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Chinese semiconductor manufacturer CXMT is pursuing customized DRAM technology as a strategic move to circumvent U.S. sanctions on HBM manufacturing tools. While the U.S. restrictions hinder CXMT's access to critical HBM equipment, the company is leveraging 3D memory and 3D Integrated Circuits (3D I

Chinese semiconductor giant CXMT (Changxin Memory Technologies) has received approval from the Shanghai Stock Exchange for a major share issuance, aiming to raise at least $4.3 billion, potentially exceeding $5 billion if demand is high. This marks the largest IPO in China in the past four years, wi

On May 25, 2026, Chinese tech giant Huawei announced a major breakthrough in chip design, claiming it will enable the production of advanced chips within five years. This development is seen as a strategic move to counter U.S. sanctions imposed since 2019, which have restricted Huawei’s access to cu

Huawei's plan to develop chip manufacturing technology equivalent to TSMC's 1.4nm process by 2031 demonstrates that US sanctions have not stifled Chinese tech companies' progress. While US restrictions have limited Huawei's access to advanced lithography equipment and related manufacturing component

Despite facing stringent U.S. sanctions, Huawei is actively working to narrow the technological gap with leading chip manufacturer TSMC. The Information reports that Huawei is intensifying its efforts in chip development through increased R&D investment, supply chain optimization, and exploration of

Amid ongoing U.S. sanctions, Huawei has announced that its high-end chips will achieve transistor density equivalent to 1.4-nanometer processes within five years, highlighting China's efforts to counteract technological restrictions. Although no independent performance data was provided, this target