SemiPulse | AI-Powered Semiconductor Supply Chain Intelligence & Market Signals

CXMT is preparing China's largest chip-sector IPO of 2026, seeking up to US$4.3 billion to expand DRAM and HBM capacity, deepen vertical integration, and challenge Samsung Electronics, SK Hynix, and Micron Technology under rising AI demand and tighter US export controls.

Syntegra Private Wealth Group LLC Decreases Stock Position in NVIDIA Corporation $NVDA - MarketBeat

0.65

news.google.com 2026-07-14 MarketBeat

iST June revenue rose as AI chip validation demand strengthened

0.92

digitimes.com 2026-07-14

Integrated Service Technology Inc. (iST) reported June 2026 consolidated revenue of about NT$426 million (US$13.24 million), up 10.47% from May and down 1.56% year on year. The Taiwan-based chip validation and analysis provider said the result reflected stronger demand tied to AI chip validation and a spillover effect from capacity constraints at packaging and testing plants.

ITF World 2026: The Semiconductor Industry Enters a New Systems Era

0.92

eetimes.com 2026-07-13

AI, heterogeneous integration, silicon photonics, chiplets, and quantum computing are converging to define the next generation of complex systems.

Semiconductor Industry System Integration AI Computing Chip Architecture 3D Integration Optics SoC Heterogeneous Integration

Sitronix sees zero-capacitance TDDI and automotive DDI drive growth

0.95

digitimes.com 2026-07-13

Sitronix Technology said this week that zero-capacitance touch with display driver integration (TDDI) and automotive display drive IC (DDI) will drive its growth in 2026, as the chipmaker reported strong June and second-quarter revenue and said demand should remain positive into the second half of the year.

SK hynix hybrid bonding push signals next phase of HBM packaging race

0.92

digitimes.com 2026-07-13

SK hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging density, thermal control, and tighter integration with AI accelerators.

Taiwan connector maker Bellwether turns high-current design into patent licensing moat

0.75

digitimes.com 2026-07-11

Bellwether Electronic has evolved from a connector and wire harness manufacturer into a technology developer shaping industry standards and generating patent licensing revenue by focusing on customer challenges in high-current connectors, high-density integration and foolproof connector design, according to Bellwether Electronic chairwoman Hsu Jui-ying, speaking at the Taiwan Venture Capital and P

Wafer Probe System Market Growth Forecast to 2035: Advanced Packaging and Heterogeneous Integration Drive Demand - News and Statistics - IndexBox

0.95

www.indexbox.io 2026-07-10 IndexBox

Samsung Electronics Develops '2.xD' Packaging Integrating HBM, Logic, and Optical Tech to Tackle AI Power and Heat Issues - finance.biggo.com

0.95

finance.biggo.com 2026-07-10 finance.biggo.com

Entegris, onsemi, and Power Integrations Shares Are Soaring, What You Need To Know - Yahoo Finance

0.92

finance.yahoo.com 2026-07-10 Yahoo Finance

Entegris, onsemi, and Power Integrations Shares Are Soaring, What You Need To Know - Yahoo Finance UK

0.92

uk.finance.yahoo.com 2026-07-10 Yahoo Finance UK

Entegris, onsemi, and Power Integrations Shares Are Soaring, What You Need To Know - The Globe and Mail

0.85

www.theglobeandmail.com 2026-07-10 The Globe and Mail

Entegris, onsemi, and Power Integrations Shares Are Soaring, What You Need To Know - TradingView

0.92

www.tradingview.com 2026-07-10 TradingView

Entegris, onsemi, and Power Integrations Shares Are Soaring, What You Need To Know - FinancialContent

0.92

markets.financialcontent.com 2026-07-10 FinancialContent

Semiconductor News & Analysis Feed