SemiPulse | AI-Powered Semiconductor Supply Chain Intelligence & Market Signals

Singapore's Competition and Consumer Commission (CCS) has approved Texas Instruments' $7.5 billion acquisition of Silicon Laboratories, marking a swift regulatory clearance within two months. Although both firms operate in overlapping product areas such as wireless connectivity SoCs, microcontroller

Semiconductor Merger Texas Instruments Silicon Laboratories Singapore Regulatory Approval Chip Industry Consolidation Wireless Connectivity SoC Microcontroller Power Management IC

NVIDIA, Australia's Firmus to jointly deploy 170,000 AI accelerators in Indonesia, targeting $30B in revenue - TNGlobal

0.92

technode.global 2026-06-29

NVIDIA and Australian AI firm Firmus Technologies have announced a strategic partnership to deploy up to 170,000 AI accelerators in Indonesia’s Batam campus, aiming for $25–$30 billion in revenue over the first six years. The collaboration leverages Firmus’s HyperCube liquid-cooled AI architecture a

AI accelerators NVIDIA Firmus Technologies Indonesia AI infrastructure cloud computing AI platform integration data center digital infrastructure

Gobi Partners leads Khazanah-backed investment in Malaysia's GreatAsic to build chip design capabilities - TNGlobal

0.92

technode.global 2026-06-22

Gobi Partners has led a $6.9 million Pre-Series A funding round in GreatAsic, a Malaysian chip design company, with participation from Khazanah Nasional Berhad’s Dana Impak fund. This investment aligns with Malaysia’s Advancing Malaysia strategy, aimed at nurturing domestic semiconductor champions a

Semiconductor Investment Malaysia Semiconductor Industry Chip Design Arm Partnership Pre-Series A Funding Malaysian Government Support Advanced Manufacturing Data Center Chips

Kenanga sees advanced packaging as next battleground in semiconductor value chain - TNGlobal

0.92

technode.global 2026-06-16

Kenanga Research believes that advanced packaging will become the next battleground in the semiconductor value chain, offering significant opportunities for Malaysia’s technology players. As Moore’s Law slows, AI and HPC applications are increasingly constrained by memory bandwidth, latency, power e

Advanced Packaging Semiconductor Value Chain Malaysia AI Chips High Performance Computing 2.5D/3D Integration HBM Wafer-Level Packaging

Malaysia's GreatAsic raises $6.9M to build custom AI chip design capabilities - TNGlobal

0.87

technode.global 2026-06-10

Malaysian fabless custom chip designer GreatAsic has raised $6.9 million in a Pre-Series A funding round led by Vertex Ventures Southeast Asia & India, with participation from Ehsan Kapital and Gobi Partners. The funds will support engineering hires, operational expansion, and the acceleration of pl

Custom Chips AI Chip Semiconductor Design Malaysia Semiconductor AI SoC Arm IP Investment Round Chip Manufacturing

Germany's Infineon, Vietnam's VinRobotics to jointly to develop humanoid robots - TNGlobal

0.65

news.google.com 2026-06-10

Singapore's Silicon Box secures $78M financing to accelerate growth in advanced packaging - TNGlobal

0.92

technode.global 2026-06-09

Singapore-based semiconductor packaging firm Silicon Box has secured S$100 million ($77.65 million) in debt financing from leading institutional investors including Ares Management Corporation, InnoVen Capital, January Capital, and Abound Capital. The facility includes an option to increase funding

Advanced Packaging Chip Integration Semiconductor Manufacturing Singapore Tech AI Chips High-precision Manufacturing Capital Financing Chip Packaging Technology

SK hynix unveils ‘iHBM’ thermal solution to boost AI performance - TNGlobal

0.92

technode.global 2026-05-26

SK hynix has unveiled its new iHBM (integrated heat management) solution aimed at enhancing the performance of high-bandwidth memory (HBM) in AI applications. By embedding integrated cooling elements (ICEs) directly into the HBM package, particularly within the heat-concentrated Die-to-Die Physical

SK hynix iHBM High Bandwidth Memory AI chips Thermal management Semiconductor packaging GPU Memory technology

Malaysia eyes 7 percent global advanced packaging share by 2035 - TNGlobal

0.8

technode.global 2026-05-11

Intel transfers semiconductor equipment to support training, research in Vietnam - TNGlobal

0.92

technode.global 2026-05-05

Semiconductor News & Analysis Feed