Semiconductor News & Analysis Feed

1279 articles
2026-06-18
digitimes.com 2026-06-18
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMESbelieves that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP develo
2026-06-18
digitimes.com 2026-06-18
A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis showed the HiSilicon Kirin 9030 processor was made on SMIC's third-generation 7nm-class N+3 process with a local metal pitch narrower than that of Intel's 18A chip used in Panther Lake.
2026-06-18
digitimes.com 2026-06-18
Following the announcement in April 2026 that the AI5 chip design had been finalized, Tesla CEO Elon Musk introduced a new benchmark, stating that under yield considerations, the AI6 chip is expected to set a new record for maximum usable computing power per wafer.
2026-06-18
digitimes.com 2026-06-18
MPI Corporation, a major probe card supplier, said AI demand is tightening supply across the probe card market and extending order visibility, with the company considering a prepayment mechanism to guarantee customers priority access to capacity.
2026-06-18
www.msn.com 2026-06-18 MSN
Micron Technology stock was rising sharply Monday amid a resurgence of the artificial-intelligence momentum trade, alongside reminders of the shortage in memory chips. Micron shares were up 10.1% at $1,081 with markets cheered by the prospect of a U.S.-Iran peace deal. Shares have been volatile as investors debate Micron’s valuation. The chip maker trades at a notably low forward price-to-earnin
2026-06-18
biz.chosun.com 2026-06-18 Chosunbiz
By  Jeong Du-yong Published 2026.06.18. 06:02 Glass substrate from Appslix, SKC's semiconductor substrate manufacturing subsidiary./Courtesy of Appslix TSMC, the world's largest foundry (contract semiconductor manufacturing) corporations, disclosed verification results for the commercialization of glass semiconductor substrates developed in an ecosystem centered on Taiwan and Japan. As a result,
2026-06-18
www.hpcwire.com 2026-06-18 HPCwire
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2026-06-18
www.siliconvalley.com 2026-06-18 SiliconValley.com
BUSINESS News Qualcomm’s latest chip promises to take smart glasses to a new level The San Diego chip maker took the stage at the Augmented World Expo in Long Beach on Tuesday to unveil the Snapdragon Reality Elite Ziad Asghar, Qualcomm’s senior vice president of XR, Wearables and Personal AI, announced its new chip technology that powers smart glasses during the Augmented World Expo in Long Beach
2026-06-18
www.eastbaytimes.com 2026-06-18 East Bay Times
BUSINESS News Qualcomm’s latest chip promises to take smart glasses to a new level The San Diego chip maker took the stage at the Augmented World Expo in Long Beach on Tuesday to unveil the Snapdragon Reality Elite Ziad Asghar, Qualcomm’s senior vice president of XR, Wearables and Personal AI, announced its new chip technology that powers smart glasses during the Augmented World Expo in Long Beach
2026-06-18
www.mercurynews.com 2026-06-18 The Mercury News
BREAKING NEWS Read the 14-point draft memorandum between the US and Iran BUSINESS News Qualcomm’s latest chip promises to take smart glasses to a new level The San Diego chip maker took the stage at the Augmented World Expo in Long Beach on Tuesday to unveil the Snapdragon Reality Elite Ziad Asghar, Qualcomm’s senior vice president of XR, Wearables and Personal AI, announced its new chip technolog
2026-06-18
www.fiercesensors.com 2026-06-18 Fierce Sensors
Fierce Network Fierce Sensors Sensors Converge Advertise About Us Sensors Applications Sensors Markets New Products Education/How-Tos IoT/Connectivity Embedded Sensors Converge Daily Byte Resources Events Subscribe SENSORS The quest for better chip design accelerates By Matt Hamblen Jun 17, 2026 12:01pm Sensors Applications Sensors Markets Automotive / Transportation Defense / Aerospace Synopsy
2026-06-17
news.google.com 2026-06-17 Phys.org
2026-06-17
hothardware.com 2026-06-17 HotHardware
Qualcomm Accelerates AI Wearables With Snapdragon Reality Elite And START by Aaron Leong — Wednesday, June 17, 2026, 09:15 AM EDT Comments Qualcomm is betting that the next wave of computing will be worn on the face and powered by AI. In two separate announcements, the chipmaker introduces Snapdragon START for personal AI smartglasses and Snapdragon Reality Elite for spatial computing. Video
2026-06-17
www.cnbc.com 2026-06-17 CNBC
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2026-06-17
www.bloomberg.com 2026-06-17 Bloomberg.com
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2026-06-17
eetimes.com 2026-06-17
The future of drones, robotics, and autonomous systems will depend not only on AI, but also on reliable communications in congested, contested, and degraded environments.
2026-06-17
seekingalpha.com 2026-06-17 Seeking Alpha
Home Earnings Analysis Tech  Micron: New Data Indicates Consensus Estimates Are Too Conservative (Earnings Preview) Jun 17, 2026, 2:32 AM ETMicron Technology, Inc. (MU) Stock, MU:CA Stock, ZMIC:CA Stock The Efficient Investor 169 Followers Follow 5 Share Save Play (12min) Comments (8) Summary Micron is experiencing unprecedented demand for DRAM, NAND, HBM, and enterprise SSDs, driving record reven
2026-06-17
www.marketscreener.com 2026-06-17 marketscreener.com
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2026-06-17
www.sandiegouniontribune.com 2026-06-17 San Diego Union-Tribune
BUSINESS TECHNOLOGY News Qualcomm’s latest chip promises to take smart glasses to a new level The San Diego chip maker took the stage at the Augmented World Expo in Long Beach on Tuesday to unveil the Snapdragon Reality Elite Ziad Asghar, Qualcomm’s senior vice president of XR, Wearables and Personal AI, announced its new chip technology that powers smart glasses during the Augmented World Expo in
2026-06-17
digitimes.com 2026-06-17
The global appetite for AI chips is putting new strain on materials suppliers, turning one of Ajinomoto's lesser-known products into a pressure point for advanced semiconductor packaging.