Semiconductor News & Analysis Feed
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2026-05-27
www.upi.com
2026-05-27
upi.com
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2026-05-27
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2026-05-27
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Europe Launches New Chip/Packaging R&D Projects
These projects include GaN/SiC packaging, quasi-monolithic integration, 3D qub
2026-05-27
aws.amazon.com
2026-05-27
Amazon Web Services (AWS)
Build high-performance generative AI systems with Strands Agents, NVIDIA NIM, and Amazon Bedrock AgentCore
by Kanishk Mahajan and Akshay Parkhi on 26 MAY 2026 in Amazon Bedrock Agents, Best Practices, Strands Agents, Technical How-to, Thought Leadership Permalink Comments Share
Building high-performance generative AI agents requires architecture that can deliver fast inference, coordinate multi
2026-05-26
news.google.com
2026-05-26
MarketBeat
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2026-05-26
www.marketbeat.com
2026-05-26
MarketBeat
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2026-05-26
www.msn.com
2026-05-26
MSN
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2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
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2026-05-26
www.marklines.com
2026-05-26
marklines.com
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2026-05-26
www.digitimes.com
2026-05-26
digitimes
When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners and the island's broader semiconductor ecosystem. The goal, she said, was to help secure a long-term supply of advanced...
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2026-05-26
stocktwits.com
2026-05-26
Stocktwits
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2026-05-26
digitimes.com
2026-05-26
When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners and the island's broader semiconductor ecosystem. The goal, she said, was to help secure a long-term supply of advanced artificial intelligence (AI) chips.
2026-05-26
digitimes.com
2026-05-26
ADATA Technology said it will present a cloud-to-edge artificial intelligence ecosystem at COMPUTEX 2026, bringing together its enterprise storage brand TRUSTA, ADATA Industrial, gaming brand XPG, and AIoT unit ATrack to showcase hardware and software integrations across data centers, PCs, and edge devices. The company announced partnerships and cross-domain integrations with Nvidia, Intel, Advant
2026-05-26
digitimes.com
2026-05-26
When Huawei unveiled its "Tau (τ) Scaling Law" at ISCAS 2026 in Shanghai, the announcement signalled more than another chip architecture update. It marked China's most ambitious attempt yet to redefine how semiconductor performance is measured in the post-Moore era.
2026-05-26
marklapedus.substack.com
2026-05-26
Semiecosystem
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Huawei Describes New Chip/Design Scaling Methodology
Using this methodology, China’s Huawei plans to develop 1.4nm chips by 20
2026-05-25
tomshardware.com
2026-05-25
Etiido Uko
SteamOS could still be affected
2026-05-25
tomshardware.com
2026-05-25
Luke James
The system requires no specialized hardware, no access to the target Wi-Fi network, and works even if the person being tracked isn't carrying a wireless device.
2026-05-25
themachinemaker.com
2026-05-25
Machine Maker
themachinemaker.com
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2026-05-25
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2026-05-25
Korea JoongAng Daily
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2026-05-25
www.huawei.com
2026-05-25
Huawei
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2026-05-25
digitimes.com
2026-05-25
Stellantis and Qualcomm expanded their multi-year collaboration to deploy Snapdragon Digital Chassis system-on-chip (SoC) solutions across Stellantis' global vehicle portfolio, affecting cockpit, connectivity, and driver-assistance systems. The move aims to standardize platforms, cut costs, and accelerate the deployment of advanced driver-assist and automated-driving features for customers worldwi