SemiPulse | AI-Powered Semiconductor Supply Chain Intelligence & Market Signals

GlobalFoundries: First Chipmaker to Support Open Standard for AI Scale Up

0.92

eetimes.com 2026-06-16

GlobalFoundries leads with the first silicon to support OCI MSA, shaking up AI data centers.

Semiconductor Industry AI Chips Optical Interconnect GPU Supply Chain Open Standard Silicon Photonics Data Center Chip Manufacturing

Samsung's Exynos 2600 doubles on-device AI performance in MLPerf benchmarks

0.95

digitimes.com 2026-06-15

Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and i

Mitsubishi Electric and Semikron Danfoss Jointly Develop New Standard Package for Power Semiconductor Modules - Business Wire

0.95

news.google.com 2026-06-08 Business Wire

Mitsubishi Electric and Semikron Danfoss Jointly Develop New Standard Package for Power Semiconductor Modules - Yahoo Finance Singapore

0.87

sg.finance.yahoo.com 2026-06-08 Yahoo Finance Singapore

This is a paid press release. Contact the press release distributor directly with any enquiries. Mitsubishi Electric and Semikron Danfoss Jointly Develop New Standard Package for Power Semiconductor Modules Business Wire Mon, 8 June 2026 at 6:00 am GMT-4 1 min read 6503.T -5.75% New LV100-type standard package with integrated 3-level circuit contributes to standardized inverter designs TOKYO, Ju

Power Semiconductors Industrial Drive Renewable Energy Green Transformation 3-Level Circuit Standard Package Inverter Design Energy Efficiency

SK Hynix plans to double wafer capacity in next five years, group chairman says - The Standard (HK)

0.88

www.thestandard.com.hk 2026-06-02 The Standard (HK)

__fail__

Huawei’s new chip design framework steers past US curbs | Fongmula | Francis Fong - The Standard (HK)

0.85

www.thestandard.com.hk 2026-06-02 The Standard (HK)

__fail__

AMD promises 13% uplift with new EXPO ‘Ultra Low Latency’ overclocking on DDR5 DIMMs

0.87

tomshardware.com 2026-06-01 Jake Roach

AMD’s upcoming EXPO ‘Ultra Low Latency’ automatic memory overclocking promises a 13% improvement over standard DDR5 speeds, as well as a 4% jump compared to standard EXPO.

AMD DDR5 Memory Overclocking EXPO Technology Gaming Performance Memory Controller Ryzen 7 9700X Latency Optimization

NVIDIA Vera CPU Sets a New Standard for Agentic Workloads in AI Factories | NVIDIA Technical Blog - NVIDIA Developer

0.92

developer.nvidia.com 2026-06-01 NVIDIA Developer

__fail__

Nvidia's long-awaited N1/N1X SoC specs leak ahead of Computex launch — N1 to feature up to 20 Arm-based cores, standard N1 equipped with 12- and 10-core configs - Tom's Hardware

0.92

www.tomshardware.com 2026-05-31 Tom's Hardware

PC Components CPUs Nvidia's long-awaited N1/N1X SoC specs leak ahead of Computex launch — N1 to feature up to 20 Arm-based cores, standard N1 equipped with 12- and 10-core configs News By Hassam Nasir published 9 hours ago The top-end N1X SKU is essentially a rebranded GB10. (Image credit: Nvidia) Share this article 7 Join the conversation Follow us Add us as a preferred source on Google Newsle

Nvidia N1 SoC N1X SoC ARM-based cores Computex System-on-Chip PC processors GPU cores

ATX12VO V3 standard shrinks the connector and maximizes power efficiency

0.92

tomshardware.com 2026-05-30 Kunal Khullar

Intel's next-generation 12V-only PSU standard reportedly adds PMBus support, smaller connectors, and improved power efficiency.

ATX12VO Power Delivery Standard PC Hardware Motherboard Connector Power Efficiency Intel Computer Components Power Management

Taiwan's Wah Lee expands into specialty gases as materials costs are passed on quarterly

0.85

digitimes.com 2026-05-27

Wah Lee Industrial said it has formally moved into investments in standard gases and other supplies needed by wafer fabs, with its Tainan logistics center set to open in the second half of 2026 to support future growth. Chairman Gary Chang also confirmed that the company will pass on higher costs for semiconductor and PCB products quarterly as raw material prices climb.

Semiconductor Materials Specialty Gases Wafer Fab Supply Chain Taiwan Semiconductor Material Costs Logistics Center Industry Investment

Wolfspeed Introduces New 3.3 kV SiC Power Modules in Two Industry-Standard Footprints to Address the Surging Demand for Energy - Wolfspeed

0.95

investor.wolfspeed.com 2026-05-21 Wolfspeed

__fail__

Wolfspeed Introduces New 3.3 kV SiC Power Modules in Two Industry-Standard Footprints to Address the Surging Demand for Energy - Business Wire

0.9

news.google.com 2026-05-21 Business Wire

__fail__

Wolfspeed Introduces New 3.3 kV SiC Power Modules in Two Industry-Standard Footprints to Address the Surging Demand for Energy - bastillepost.com

0.95

www.bastillepost.com 2026-05-21 bastillepost.com