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As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven investment wave is now spreading beyond foundries into the equipment, materials, factory engineering, and inspection supply chains.

South Korea's plan to push semiconductor investment beyond the greater Seoul area is taking clearer shape, with Samsung Electronics reportedly moving closer to a new chip hub in Gwangju while SK Hynix continues to weigh a site in South Jeolla Province against overseas investment options.

South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments, as the two chipmakers review plans that could include front-end fabrication plants and packaging facilities across the country's Honam and Chungcheong regions. Both companies say no final decisions have been made.

© Nokia General | June 22, 2026 Nokia announces $30M semiconductor investment in Pennsylvania Evertiq The investment in advanced test and packaging (ATP) operations in Allentown, Pennsylvania, will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity in the US. Nokia has announced a major expansion of its advanced test and

SK Hynix is reported to have held a private meeting with U.S. Deputy Secretary of State Allison Hooker, with industry sources speculating the discussions covered high-bandwidth memory cooperation with major U.S. technology firms and potential semiconductor investment expansion.

A labor dispute at Samsung Electronics is sharpening a debate with implications well beyond South Korea: how semiconductor companies balance worker compensation against the capital-intensive investment cycles that determine who leads in chips.The article requires paid subscription.Subscribe Now