Industry Analysis
ASML’s EUV dominance is triggering a cascade across the semiconductor stack: the rush to 3nm/5nm nodes forces TSMC, Samsung, and Intel to aggressively expand capacity, creating inelastic demand for EUV tools and pressuring materials, metrology, and EDA to evolve in lockstep. Geopolitical compliance is now a structural cost—U.S. export controls may temporarily boost ASML’s non-China market share but erode long-term global fab utilization and inflate supply chain redundancy. Nikon and Canon remain locked out of EUV, yet rivals like Tokyo Electron could pivot via hybrid bonding and advanced packaging. Over the next 12–24 months, the AI chip arms race will exacerbate EUV bottlenecks; ASML’s order backlog already stretches into 2028. Its real vulnerability isn’t technological disruption—it’s cyclical capex pullbacks driven by macroeconomic volatility.
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