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South Korea is considering exempting research and development personnel from the country's 52-hour workweek limit inside proposed Mega Special Zones. These would include a planned second semiconductor cluster in the southwestern Honam region.

As South Korea moves to accelerate a new semiconductor cluster in the country's southwest, ruling-party officials have returned to one comparison: Kumamoto.

South Korea on June 29 unveiled a large-scale investment plan for the country's Honam region in the southwest, which mainly covers the city of Gwangju and North and South Jeolla provinces, including semiconductor clusters for Samsung Electronics and SK Hynix, AI data centers, and regional infrastructure. The plan is seen as a key move by the South Korean government to respond to surging AI chip de

PC Components RAM DRAM SK hynix to invest $712.5 billion in South Korean operations — Cheongju NAND expansion, Yongin Semiconductor Cluster for DRAM detailed News By Anton Shilov Published July 3, 2026 Over the next decades. When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. (Image credit: SK hynix) Share this article 0 Join the conversation

Samsung said on June 29 it will invest a combined KRW2,655 trillion (approx. US$1.72 trillion as of June 30, 2026) across its domestic operations, splitting the figure between continued buildout of its existing Pyeongtaek and Yongin semiconductor clusters and a fresh push into Korea's southwestern Honam region, where the bulk of the new money is aimed at memory capacity.

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SK Hynix is racing to complete the first cleanroom at its massive Yongin Semiconductor Cluster in Gyeonggi Province, South Korea, by February 2027, ahead of rival capacity expansion timelines. The site's first fabrication facility will break from conventional flat-floor layouts, stacking production floors three levels high in a pioneering triple-deck fab design.

Catalonia is unifying its fragmented tech ecosystem into a coordinated semiconductor cluster spanning photonics, packaging, AI, and chip research.