Semiconductor News & Analysis Feed

ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment of a former TSMC executive as an independent director by Chairman Chiang Shang-yi has also drawn industry attention to the commercialization progress of its high-speed optical transceiver business.

The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to divers

Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of 24 tracked companies posting positive year-over-year gains, according to monthly revenue filings compiled for the period. The results underscore continued downstream demand driven by AI-related chip shipments and a broader recovery in consumer electronics.