Semiconductor News & Analysis Feed

Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.

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1Samsung Display, LG Display to Supply OLED Panels for Apple iPhone 18 Pro Models2Bezos-Backed Prometheus Startup Raises $10 Billion Without a Prototype3DRAM Prices Seen Rising Up to 48% in Q2 as Pace of Gains Slows4SK hynix Says Hybrid Bonding HBM Yield Improved5Qualcomm to Ship First Data-Center Chips This Year6Galaxy S26 Ultra Uses Qualcomm Snapdragon 8 Elite 5th Gen7Samsung Electronics Targets

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