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EUV47 3nm34 DRAM11 HBM8 AI8 GPU6 AI chips6 2nm5 CPU4 NAND4 DDR54 RISC-V4 3D printing4 quantum computing4 3D integration3
2026-07-14
Intel challenges HBM leaders with XBM and ZAM in a bid to reshape AI memory
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digitimes.com 2026-07-14
Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization targeted for around 2030. Although the path is fraught with ecosystem barriers and compatibility hurdles, Intel's parallel development of Z-angle memory (ZAM) and cross-batch memory (XBM) underscores its determination to re-enter the DRAM market, as it simultaneou
2026-07-14
GaN Charger Manufacturer WeCent Unveils WEX100 Pro with AI Smart Display and Intelligent Cooling System - openPR.com
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news.google.com 2026-07-14 openPR.com
2026-07-14
Cadence Design Systems (CDNS) Suffers a Larger Drop Than the General Market: Key Insights - Yahoo Finance Singapore
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news.google.com 2026-07-14 Yahoo Finance Singapore
2026-07-14
World Reticle Pod Cleaning System - Market Analysis, Forecast, Size, Trends and Insights - IndexBox
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news.google.com 2026-07-14 IndexBox
2026-07-14
Infineon and LS Electric Sign MoU to Co-Develop DC Power Systems for AI Data Centers - MLQ.ai
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news.google.com 2026-07-14 MLQ.ai
2026-07-14
Intel's new space-grade Starfire chip is a Panther Lake SoC that puts an 18A CPU into orbit
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tomshardware.com 2026-07-14 Luke James
Intel has unveiled Starfire, a space-grade system-on-chip designed for the U.S. government.
IntelSpace-grade chipStarfirePanther Lake SoCIntel 18ANPUXe GPURadiation-hardened
2026-07-13
Beijing's 'Manhattan Project': China close to cracking code of EUV Lithography system - tech that controls the world - The Times of India
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news.google.com 2026-07-13 The Times of India
2026-07-13
Goldman Sachs Adjusts Price Target on Cadence Design Systems to $470 From $410, Maintains Buy Rating - marketscreener.com
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news.google.com 2026-07-13 marketscreener.com
2026-07-13
ITF World 2026: The Semiconductor Industry Enters a New Systems Era
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eetimes.com 2026-07-13
AI, heterogeneous integration, silicon photonics, chiplets, and quantum computing are converging to define the next generation of complex systems.
Semiconductor IndustrySystem IntegrationAI ComputingChip Architecture3D IntegrationOpticsSoCHeterogeneous Integration
2026-07-13
Infineon Technologies, LS Electric to Deliver DC Power Infrastructure Systems - marketscreener.com
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news.google.com 2026-07-13 marketscreener.com
2026-07-13
Beijing's 'Manhattan Project': China close to cracking code of EUV Lithography system - tech that control - The Times of India
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news.google.com 2026-07-13 The Times of India
2026-07-13
Tesla AI5 chip reportedly completes tape-out for Samsung's Texas fab
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digitimes.com 2026-07-13
Samsung Electronics has reportedly completed the tape-out of its version of Tesla's AI5 chip for self-driving systems, with the chip scheduled to be manufactured at Samsung's Taylor, Texas, fab using the company's 2nm process.
2026-07-13
RISC-V Is Inevitable, State of the Union Keynote Argues
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eetimes.com 2026-07-13 Pablo Valerio
The RISC-V open standard and the emergence of RVA23 silicon now provide the necessary flexibility and modularity without the limitations of traditional proprietary systems.
RISC-VOpen Instruction Set ArchitectureData CenterServer ChipSemiconductor TechnologyOpen Source EcosystemAI AcceleratorChip Architecture
2026-07-13
Taiwan's auto parts makers pivot to high-tech as AI cooling, chip equipment demand surges
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digitimes.com 2026-07-13
Taiwan's automotive parts makers are accelerating their transformation into high-tech suppliers as the global expansion of advanced semiconductor capacity and AI server infrastructure creates new demand for precision-engineered components. Companies traditionally focused on powertrain, transmission, and safety systems are leveraging decades of manufacturing expertise to secure positions in semicon
2026-07-13
India roundup: India's chip strategy tests its ability to build a competitive ecosystem
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digitimes.com 2026-07-13
India is moving from semiconductor planning to execution, using funding, tariff changes, foreign investment approvals, and regional development efforts to build a broader electronics ecosystem beyond assembly.
2026-07-13
Modular Dry Vacuum Systems Market Forecast Points Higher Toward 2035 on Semiconductor Fab Expansion - IndexBox
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news.google.com 2026-07-13 IndexBox
2026-07-12
Oxygen Delivery Systems Market Growth Outlook to 2035: Semiconductor, Homecare, and Industrial Automation Demand - News and Statistics - IndexBox
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news.google.com 2026-07-12 IndexBox
2026-07-12
Thermal Process Systems Market Growth Outlook to 2035: Semiconductor and EV Battery Demand Accelerate - News and Statistics - IndexBox
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www.indexbox.io 2026-07-12 IndexBox
2026-07-11
The OptiMOS 6 40 V MOSFET - Infineon bets on efficient drive systems - ad-hoc-news.de
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www.ad-hoc-news.de 2026-07-11 ad-hoc-news.de
2026-07-11
Samsung's CXL 3.1 memory delay lays bare Intel, AMD server platform lag
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digitimes.com 2026-07-11
Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from Intel and AMD pushed back the broader PCIe 6.0 ecosystem, highlighting how AI infrastructure adoption increasingly depends on platform readiness rather than individual components.