Semiconductor News & Analysis Feed
1411 articles
2026-05-26
www.tomshardware.com
2026-05-26
Tom's Hardware
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2026-05-26
www.blocksandfiles.com
2026-05-26
Blocks & Files
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2026-05-26
en.bloomingbit.io
2026-05-26
bloomingbit
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2026-05-26
overclock3d.net
2026-05-26
OC3D
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2026-05-26
en.sedaily.com
2026-05-26
Seoul Economic Daily
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2026-05-26
www.awazthevoice.in
2026-05-26
Awaz The Voice
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2026-05-26
cryptobriefing.com
2026-05-26
Crypto Briefing
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2026-05-26
videocardz.com
2026-05-26
VideoCardz.com
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2026-05-26
letsdatascience.com
2026-05-26
Let's Data Science
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2026-05-26
www.koreatimes.co.kr
2026-05-26
The Korea Times
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2026-05-26
www.koreaherald.com
2026-05-26
The Korea Herald
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2026-05-26
www.chosun.com
2026-05-26
조선일보
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2026-05-26
www.koreaherald.com
2026-05-26
The Korea Herald
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2026-05-26
www.investing.com
2026-05-26
Investing.com
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2026-05-26
cryptorank.io
2026-05-26
CryptoRank
SK Hynix stock jumped nearly 7% as Nvidia’s blowout quarter (fiscal Q1 revenue $81.6bn, data-centre revenue $75.2bn) and surging AI demand drove South Korea’s KOSPI above 8,000. SK Hynix reported Q1 revenue of 52.58 trillion won and operating profit of 37.61 trillion won (72% margin), analysts raised targets (UBS 1.7m won, Mirae 3.2m won) and TrendForce forecasts DRAM and NAND contract prices to r
2026-05-26
vir.com.vn
2026-05-26
Vietnam Investment Review - VIR
SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.
[1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b
2026-05-26
www.tradingview.com
2026-05-26
TradingView
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2026-05-26
www.trendforce.com
2026-05-26
TrendForce
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2026-05-26
www.digitimes.com
2026-05-26
digitimes
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs...
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2026-05-26
www.businesskorea.co.kr
2026-05-26
Businesskorea
The Company Says iHBM Cuts Thermal Resistance By Over 30%
SK Hynix unveiled its ‘iHBM’ technology on May 26, which significantly reduces heat generation by integrating a unified cooling element within the HBM package. (Photo source: SK Hynix)
SK Hynix has made a bold bet on solving the heat problem, which has emerged as the biggest challenge of the artificial intelligence (AI) semiconductor era