SemiPulse — Semiconductor Intelligence

Tech Forum 2026: How much longer can semiconductors sustain Taiwan?

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digitimes.com 2026-05-21

During a keynote discussion session at Tech Forum 2026, DIGITIMES senior reporter Monica Chen and semiconductor analyst Andrew Lu shared their views on current AI server technology transformations, concerns over capital expenditure bubbles among global cloud giants, changes in application-specific integrated circuits (ASICs) and chip architectures, and TSMC's global expansion strategy.

AMD CEO meets with TSMC CEO in Taiwan as it expands US chip output

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digitimes.com 2026-05-21

Advanced Micro Devices (AMD) CEO Lisa Su stated that the company plans to invest more than US$10 billion in Taiwan's industrial ecosystem to accelerate the development of artificial intelligence (AI) infrastructure. The announcement was made during her visit to Taiwan, where she also disclosed the latest progress in collaborations with Taiwan Semiconductor Manufacturing Company (TSMC), backend pac

OSE targets AI server SMT growth as memory demand lifts outlook

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digitimes.com 2026-05-21

Orient Semiconductor Electronics (OSE) said that strong memory market demand is lifting its outlook and expanding its role in the memory supply chain, while also strengthening its importance in surface-mount technology (SMT) for AI server boards with major US clients.

Demand surge for power semiconductors reshapes data-center power and cooling, pushing suppliers toward SiC and GaN

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digitimes.com 2026-05-21

Demand for power components is surging as AI servers adopt high-voltage direct current power delivery and advanced cooling technologies. This shift could increase component density and design complexity across the data center supply chain. Taiwanese power semiconductor makers are moving into cooling and power-management MOS technologies, as well as higher-spec upgrades.

AI chip boom strains ABF substrate supply chain

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digitimes.com 2026-05-21

AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used in high-end CPUs, GPUs, ASICs, and networking chips.

US targets Hua Hong's 7nm nodes while China targets South Korean partners to evade sanctions

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digitimes.com 2026-05-21

The US Department of Commerce (DOC) has reportedly issued "is-informed" letters to several major wafer fab equipment (WFE) manufacturers, ordering an immediate halt to tool shipments destined for Hua Hong Semiconductor, China's second-largest foundry. The restrictions specifically target two facilities within the Hua Hong Group, including its subsidiary Huali Microelectronics, which US officials b

AMD commits over US$10 billion to Taiwan ecosystem to expand AI packaging and infrastructure capacity

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digitimes.com 2026-05-21

AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for next-generation artificial intelligence (AI) infrastructure. The initiative aims to strengthen manufacturing capabilities, accelerate the deployment of AI systems, and support the growing demand for high-performance c

Reassessment of semiconductor and AI-related stocks following NVIDIA's earnings release. - 富途牛牛

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news.futunn.com 2026-05-21 富途牛牛

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New semiconductor building blocks make power converters smaller, more affordable - EurekAlert!

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www.eurekalert.org 2026-05-21 EurekAlert!

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Is Taiwan Semiconductor Manufacturing (TSM) One of the Best Semiconductor Stocks With the Highest Upside Potential Right Now? - Yahoo Finance

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finance.yahoo.com 2026-05-21 Yahoo Finance

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