Semiconductor News & Analysis Feed
153 articles
2026-05-25
www.huaweicentral.com
2026-05-25
Huawei Central
HUAWEI
Huawei Kirin 2026 Chip: 238 MTr/mm2 transistor density rivaling TSMC’s 3nm
Published
4 hours ago
on
May 25, 2026
By
Deng Li
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Huawei has revealed its Kirin 2026 details and it reveals massive upgrade in the chip arachitecture including transistor density.
He Tingbo, Director and President of Semiconductor B
2026-05-25
www.cnbc.com
2026-05-25
CNBC
SHANGHAI — Chinese tech giant Huawei on Monday touted a new approach to developing advanced semiconductors despite U.S. sanctions, as Nvidia
struggles to sell its high-end chips in China.
Huawei said it developed a new engineering approach called “LogicFolding” to manufacture its Kirin smartphone chips this fall.
That breakthrough comes as Nvidia
faces U.S. export restrictions in China and App
2026-05-25
digitimes.com
2026-05-25
Below are the most-read DIGITIMES Asiastories from the week of May 18-24, 2026:
2026-05-25
digitimes.com
2026-05-25
For AMD CEO Lisa Su, the current moment presents an opening that Nvidia does not have. Nvidia's high-end chips have repeatedly faced scrutiny and export restrictions in China, and Nvidia CEO Jensen Huang only recently confirmed in May that Nvidia once held as much as 95% market share there. That dominance has since been reset, with the bulk of that share ceding to domestic rival Huawei.
2026-05-24
www.thestreet.com
2026-05-24
thestreet.com
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2026-05-24
www.marketbeat.com
2026-05-24
MarketBeat
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2026-05-24
wccftech.com
2026-05-24
Wccftech
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2026-05-20
www.quiverquant.com
2026-05-20
Quiver Quantitative
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2026-05-20
www.msn.com
2026-05-20
MSN
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2026-05-20
www.cnbc.com
2026-05-20
CNBC
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2026-05-20
www.barrons.com
2026-05-20
Barron's
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2026-05-20
www.marketbeat.com
2026-05-20
MarketBeat
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2026-05-19
www.marketbeat.com
2026-05-19
MarketBeat
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2026-05-19
seekingalpha.com
2026-05-19
Seeking Alpha
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2026-05-19
www.gurufocus.com
2026-05-19
GuruFocus
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2026-05-18
www.marketbeat.com
2026-05-18
MarketBeat
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2026-05-18
www.digitimes.com
2026-05-18
digitimes
Samsung Electronics has significantly improved yields for its latest DRAM technologies used in high-bandwidth memory (HBM), according toIT Chosun, underscoring the intensifying race among memory makers to secure leadership in AI-related...The article requires paid subscription.Subscribe Now
2026-05-18
www.digitimes.com
2026-05-18
digitimes
Apple has increasingly relied on "binned" chips — processors with disabled or defective cores — to expand into lower-priced devices, according to a recent report byThe Wall Street Journal. The strategy allows the company to reuse chips that would...The article requires paid subscription.Subscribe Now
2026-05-18
www.japantimes.co.jp
2026-05-18
The Japan Times
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2026-05-18
www.digitimes.com
2026-05-18
digitimes
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