Semiconductor News & Analysis Feed
481 articles
2026-07-06
news.google.com
2026-07-06
The Globe and Mail
2026-07-06
news.google.com
2026-07-06
AOL.com
2026-07-06
news.google.com
2026-07-06
The Globe and Mail
2026-07-06
news.google.com
2026-07-06
Yahoo Finance
2026-07-06
news.google.com
2026-07-06
The Motley Fool
2026-07-06
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2026-07-06
Moomoo
2026-07-06
news.google.com
2026-07-06
digitimes
2026-07-06
news.google.com
2026-07-06
Nature
2026-07-06
digitimes.com
2026-07-06
As Moore's Law approaches its physical limits, simply shrinking semiconductor process nodes is no longer the sole path to improving chip performance.
2026-07-06
digitimes.com
2026-07-06
Hon Hai Precision Industry (Foxconn) reported consolidated revenue for June 2026 on July 5, with continued demand for AI servers and cloud networking products driving record performance. Revenue for June, the second quarter, and the first half of 2026 all reached record highs for the corresponding periods.
2026-07-06
digitimes.com
2026-07-06
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.
2026-07-06
digitimes.com
2026-07-06
Rising demand for AI servers and high-performance computing (HPC) continues to drive price increases across the upstream PCB materials supply chain.
2026-07-06
digitimes.com
2026-07-06
Anthropic's reported move into in-house chip development could matter well beyond Silicon Valley if it helps lower the cost of running AI services worldwide. By prioritizing cheaper inference rather than elite performance, the startup may be signaling a more pragmatic path that could influence how global AI systems are built and priced.
2026-07-06
digitimes.com
2026-07-06
Zhonghao Xinying (Hangzhou) Technology has launched its new self-developed high-performance TPU AI processor, Xuyu, alongside Taize 2.0, a software-hardware integrated AI computing platform built around the chip.
2026-07-06
digitimes.com
2026-07-06
SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.
2026-07-06
digitimes.com
2026-07-06
Dutch semiconductor equipment startup Nearfield Instruments has completed a US$380 million Series D funding round, the largest-ever fundraising for a Dutch deep-tech company. The company is now targeting an initial public offering (IPO) in 2028.
2026-07-06
news.google.com
2026-07-06
Boston Herald
2026-07-05
news.google.com
2026-07-05
Stocktwits
2026-07-05
news.google.com
2026-07-05
Pandaily
2026-07-05
digitimes.com
2026-07-05
Advantest said it has partnered with OpenLight to develop a scalable silicon photonics (SiPh) test solution for mass production environments. The announcement comes as artificial intelligence (AI) and high-performance computing workloads increase demand for silicon photonics and co-packaged optics in data centers.