Semiconductor News & Analysis Feed
2424 articles
2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize
2026-05-26
stocktwits.com
2026-05-26
Stocktwits
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2026-05-26
news.google.com
2026-05-26
The Globe and Mail
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2026-05-26
digitimes.com
2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com
2026-05-26
Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK Hynix as the South Korean rivals delay investment in their own next-generation NAND technologies, according to ZDNet Korea.
2026-05-26
digitimes.com
2026-05-26
Taiwan Semiconductor Manufacturing Company (TSMC) will reportedly cut employee bonuses by 15%, prompting some employees to voice dissatisfaction on social media. They argued that while TSMC's profits have soared, the share allocated to employee bonuses has decreased rather than increased, with some employees threatening to follow Samsung Electronics' union with a strike to fight for their rights.
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-26
digitimes.com
2026-05-26
ADATA Technology said it will present a cloud-to-edge artificial intelligence ecosystem at COMPUTEX 2026, bringing together its enterprise storage brand TRUSTA, ADATA Industrial, gaming brand XPG, and AIoT unit ATrack to showcase hardware and software integrations across data centers, PCs, and edge devices. The company announced partnerships and cross-domain integrations with Nvidia, Intel, Advant
2026-05-26
digitimes.com
2026-05-26
Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks and tighter supply expected through 2027. The developments could reshape supply chains for servers, data centers, and high-power consumer electronics worldwide, and accelerate global investment in components.
2026-05-26
digitimes.com
2026-05-26
As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging technology than a strategic reshuffling of supply aimed at safeguarding critical American industries.
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.
2026-05-26
digitimes.com
2026-05-26
Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products.
2026-05-26
digitimes.com
2026-05-26
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.
2026-05-26
digitimes.com
2026-05-26
Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV technologies to reduce energy consumption per wafer at the process level, while continuing to deepen its presence in Taiwan. The company also plans to hire around 1,000 new employees in Taiwan in 2026 to support custome
2026-05-26
digitimes.com
2026-05-26
Facing expanding opportunities in both optical communications and satellite connectivity, Dennis Chen, chairman of WIN Semiconductors, said the company is actively advancing a range of products, including driver ICs, continuous-wave (CW) lasers, and photodiodes, while also ramping up capacity in anticipation of growing demand from next-generation networks.
2026-05-26
digitimes.com
2026-05-26
Taiwan-based AI server maker Wiwynn is accelerating its global expansion as surging demand for AI infrastructure creates mounting pressure on power supply, production capacity, and critical component availability.
2026-05-26
digitimes.com
2026-05-26
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutt
2026-05-26
digitimes.com
2026-05-26
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die — the specialized intellectual property that makes those chips communicate reliably has become critical infrastructure. InPsytech, a Taiwanese IP design firm and subsidiary of Egis Technology, has staked its business on exactly t
2026-05-26
digitimes.com
2026-05-26
Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account for more than half of revenue. Despite continued uncertainty in the global environment, Peng remains cautiously optimistic about the second half of 2026 and expects the company to maintain relatively strong performa
2026-05-26
www.theglobeandmail.com
2026-05-26
The Globe and Mail
Key Points
Nvidia recently announced a significant increase to its payout.
The company's robust financials give it plenty of room to make further hikes in the future.
Its new yield puts it in line with that of other tech stocks.
10 stocks we like better than Nvidia ›
When you think of Nvidia (NASDAQ: NVDA), dividends probably aren't one of the things that come to mind. But given just how much