Semiconductor News & Analysis Feed
2424 articles
2026-05-26
www.marketbeat.com
2026-05-26
MarketBeat
__fail__
2026-05-26
www.marketbeat.com
2026-05-26
MarketBeat
__fail__
2026-05-26
www.marketbeat.com
2026-05-26
MarketBeat
__fail__
2026-05-26
www.marketbeat.com
2026-05-26
MarketBeat
__fail__
2026-05-26
www.marketbeat.com
2026-05-26
MarketBeat
__fail__
2026-05-26
www.marketbeat.com
2026-05-26
MarketBeat
__fail__
2026-05-26
www.marketbeat.com
2026-05-26
MarketBeat
__fail__
2026-05-26
cryptobriefing.com
2026-05-26
Crypto Briefing
__fail__
2026-05-26
www.msn.com
2026-05-26
MSN
__fail__
2026-05-26
finance.yahoo.com
2026-05-26
Yahoo Finance
__fail__
2026-05-26
news.financial
2026-05-26
news.financial
__fail__
2026-05-26
www.marklines.com
2026-05-26
marklines.com
__fail__
2026-05-26
vir.com.vn
2026-05-26
Vietnam Investment Review - VIR
SEOUL, South Korea, May 26, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.
[1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-b
2026-05-26
www.channelnewsasia.com
2026-05-26
CNA
Business
'Lazy' narrative to connect AI to job cuts, says Nvidia boss Jensen Huang
"If you don't engage the technology of your time, you'll just simply be left behind," Mr Huang told CNA's Victoria Jen in a wide-ranging interview.
Nvidia CEO Jensen Huang prior to a state dinner with President Donald Trump and Chinese President Xi Jinping at the Great Hall of the People on May 14, 2026, in Beiji
2026-05-26
www.digitimes.com
2026-05-26
digitimes
Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV technologies to reduce energy consumption per wafer at the process level,...
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time the
2026-05-26
www.ad-hoc-news.de
2026-05-26
AD HOC NEWS
Infineons, Billion
Infineon's €1.5 Billion AI Revenue Bet Fuels a 100% Rally and a Corporate Reshuffle
26.05.2026 - 05:01:42 | boerse-global.de
Infineon stock nearly doubles in 2026 on AI data center sales forecast of €1.5B, with restructuring and strong margins boosting investor confidence.
Infineon's €1.5 Billion AI Revenue Bet Fuels a 100% Rally and a Corporate Reshuffle - Foto: über boerse-g
2026-05-26
www.businesskorea.co.kr
2026-05-26
Businesskorea
The Company Says iHBM Cuts Thermal Resistance By Over 30%
SK Hynix unveiled its ‘iHBM’ technology on May 26, which significantly reduces heat generation by integrating a unified cooling element within the HBM package. (Photo source: SK Hynix)
SK Hynix has made a bold bet on solving the heat problem, which has emerged as the biggest challenge of the artificial intelligence (AI) semiconductor era
2026-05-26
www.tradingview.com
2026-05-26
TradingView
__fail__
2026-05-26
www.prnewswire.com
2026-05-26
PR Newswire
AIC to Showcase Next-Generation AI Infrastructure and Host Strategic Panel with NVIDIA and VAST Data at COMPUTEX 2026 Deutschland - English
VOM NACHRICHTENDIENST
AIC
26 Mai, 2026, 02:18 GMT
ARTIKEL TEILEN
TAIPEI, May 26, 2026 /PRNewswire/ -- AIC, a leading provider of AI storage and computing solutions, is proud to announce its participation in COMPUTEX 2026. From June 2 to June 5, AIC
2026-05-26
www.asiae.co.kr
2026-05-26
아시아경제
Equipped with Cooling Component (ICE) Inside HBM Package
Over 30% Reduction in Thermal Resistance
Proven MR-MUF Process Applied
Amid the artificial intelligence (AI) boom, a game-changer has emerged to tackle the biggest challenge in semiconductor high-density integration: the 'heat generation' issue.
On May 26, SK hynix unveiled its next-generation memory technology, 'iHBM,' which maximize