Semiconductor News & Analysis Feed
2345 articles
2026-06-24
www.hpcwire.com
2026-06-24
HPCwire
www.hpcwire.com
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a10ccf40be01f39d
Performance and Security by Cloudflare
Privacy
2026-06-24
finance.yahoo.com
2026-06-24
Yahoo Finance
KOSPI’s Recovery Fades as Early Gains Evaporate from SK Hynix
Darryn Pollock
Tue, June 23, 2026 at 10:16 PM PDT 3 min read
005930.KS
+9.84%
000660.KS
+0.98%
MU
-1.13%
Trade MU on Coinbase
Trading disclosure
South Korea's KOSPI opened sharply higher on June 24 after the previous session's 10% crash, but the recovery quickly ran out of steam. SK Hynix shed further ground while Samsung held relative
2026-06-24
beincrypto.com
2026-06-24
BeInCrypto
Subscribe
English
News
Breaking
Regulation & Policy
Institutional
DeFi & Infrastructure
AI & Technology
Opinion
Markets
Prices
Exchanges
Converter
Awards
BeInCrypto Institutional 100
BeInCrypto 100
Selection Process
Experts Network
Legal & Regulatory
Market Intelligence Council
Future Tech & AI
Institutional Strategy & On-chain Finance
Events
Learn
More
Crypto Rewards
Top Picks
Trading
Businesses
2026-06-24
www.weex.com
2026-06-24
WEEX
Qualcomm (NASDAQ: QCOM) has done something unusual in 2026: it has rallied past where most of Wall Street thinks it should trade. As of June 23, 2026, QCOM changed hands near $222, yet the consensus 12-month price target sits around $184 — meaning the stock is priced above the average analyst forecast. That inversion is the whole story. QCOM is no longer a sleepy handset-and-royalty name trading a
2026-06-24
evertiq.com
2026-06-24
Evertiq
© tsmc
Business | June 24, 2026
TSMC partners with Amkor to accelerate advanced packaging in US
Evertiq
The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model.
TSMC and Amkor Technology have annou
2026-06-24
kalkine.com.au
2026-06-24
Kalkine
Highlights
AI shares rose 13.73% to AUD 0.058 during the morning session on 24 June 2026 following a strategic AI chip design presentation
The company introduced “Chipforge”, an AI-native sovereign semiconductor design platform
Presentation highlighted a global shift toward sovereign chip investment exceeding USD 115 billion
AI positioned AI-assisted design as a solution to industry-wide engineer
2026-06-24
pulse2.com
2026-06-24
Pulse 2.0
Micron Technology announced a strategic agreement with Anthropic focused on scaling next-generation AI infrastructure. The collaboration spans memory and storage AI architecture design, a supply agreement, enterprise adoption of Claude across Micron, and a strategic investment in Anthropic’s Series H funding round.
Micron said the agreement connects the demands of frontier AI models with how infr
2026-06-24
www.hpcwire.com
2026-06-24
HPCwire
www.hpcwire.com
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a10cb8071af8379a
Performance and Security by Cloudflare
Privacy
2026-06-24
www.hpcwire.com
2026-06-24
HPCwire
www.hpcwire.com
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a10c97054e603af4
Performance and Security by Cloudflare
Privacy
2026-06-24
blogs.nvidia.com
2026-06-24
NVIDIA Blog
NVIDIA and AWS Collaborate to Bring AI to Production at Scale
June 23, 2026 by Josiah Byers
0
Share
Building AI systems at scale is demanding, requiring low-latency inference, fast vector search, strong GPU price-performance and infrastructure that can grow without multiplying operational complexity.
NVIDIA’s latest work with Amazon Web Services (AWS) addresses each of those constraints. Acro
2026-06-24
digitimes.com
2026-06-24
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global readers, the shift could shape future device performance, supply chains, and where advanced semiconductors are manufactured and assembled.
2026-06-24
digitimes.com
2026-06-24
Taiwan's economy is expected to maintain strong momentum through the second half of 2026, supported by accelerating AI-related investment, resilient exports, and robust demand across the semiconductor, memory, and server supply chains. Industry analysts and government officials increasingly believe growth could surpass earlier expectations as AI infrastructure spending continues to expand worldwid
2026-06-24
digitimes.com
2026-06-24
Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the semiconductor supply chain.
2026-06-24
digitimes.com
2026-06-24
At VivaTech 2026 in Paris last week, Philippe Keryer, Chief Strategy and Innovation Officer at Thales, identified Europe's core quantum challenge in a single observation: "The problem is not really how we invent, it's really how we scale."
2026-06-24
digitimes.com
2026-06-24
Hwatsing Technology, China's leading domestic supplier of chemical mechanical planarization (CMP) equipment, is seeking up to CNY4 billion (approx. US$552 million) through a private placement to expand chip equipment capacity, strengthen wafer reclamation services, and accelerate high-end semiconductor tool R&D.
2026-06-24
digitimes.com
2026-06-24
The AI boom is accelerating upgrades in thermal management and power management, and it is also triggering a revolution in voltage regulator module (VRM) architecture, with workloads pushing the industry from doubler-based designs to direct native multi-phase control. Industry insiders say the growing shortage of power components has three main causes: inventory corrections over the past three yea
2026-06-24
digitimes.com
2026-06-24
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources reported. According to ET News, the DRAM subcommittee completed its review, and the JEDEC board gave final approval, positioning the standard to influence AI semiconductor cost structures and substrate choices.
2026-06-24
digitimes.com
2026-06-24
Strong demand for AI servers is driving higher shipments of advanced printed circuit board (PCB) products in Taiwan, but it is also tightening supply of key materials and resources, adding fresh uncertainty to the industry. The Taiwan Printed Circuit Association (TPCA) and the Industry, Science and Technology International Strategy Center (ISTI) said Taiwan's PCB manufacturing output reached NT$24
2026-06-24
digitimes.com
2026-06-24
Former SMIC CEO Tzu-yin Chiu is extending his semiconductor materials strategy into photomasks, one of the most critical upstream links in chip manufacturing. Guangzhou Xinrui Photomask Technology, also known as New Ray Mask, where Chiu serves as chairman, has begun IPO listing guidance, marking another step in his shift from foundry operations to China's chip materials supply chain.
2026-06-24
digitimes.com
2026-06-24
Cerebras Systems' first public quarter highlighted its dependence on a small set of large partners — OpenAI and AWS anchor the business — even as management declined on the call to quantify how much revenue its biggest customers represent (deferring those concentration figures to its SEC filings).