Semiconductor News & Analysis Feed
627 articles
2026-06-28
tomshardware.com
2026-06-28
Mark Tyson
At the International Supercomputing Conference this past week, Lenovo reportedly said the memory market 'it will never be like it was last year.'
2026-06-27
tomshardware.com
2026-06-27
Mark Tyson
Enthusiast demos Microsoft’s newest OS running 'completely stable' on a Core 2 Quad Q6600, using a DDR1 motherboard, supported by an ATi Radeon HD 4650 AGP graphics card.
2026-06-27
news.futunn.com
2026-06-27
富途牛牛
__fail__
2026-06-27
digitimes.com
2026-06-27
MediaTek hosted MARC Workshop 2026 on June 24 through the MediaTek Advanced Research Center (MARC), recognizing the year's university-industry collaboration outcomes while outlining forward-looking R&D priorities in AI, satellite communications and next-generation connectivity.
2026-06-27
www.msn.com
2026-06-27
MSN
Applied Materials (AMAT) held a master class event this week, and much of the focus was on the company's positioning in dynamic random access memory and advanced packaging, Wall Street analysts said.
“In our view, these insights reflect broader tech trends reshaping the entire semi supply chain,” Susquehanna analyst Mehdi Hosseini wrote in a note to clients. “The rising complexity of next-gen DRA
2026-06-26
seekingalpha.com
2026-06-26
Seeking Alpha
__fail__
2026-06-26
tomshardware.com
2026-06-26
Hassam Nasir
A small victory in the face of a gargantuan problem.
2026-06-26
tomshardware.com
2026-06-26
Luke James
Microsoft has extended its free consumer Windows 10 Extended Security Updates (ESU) program by a year, pushing the cutoff for critical security patches to October 14th, 2027.
2026-06-26
www.indexbox.io
2026-06-26
IndexBox
This website is using a security service to protect itself from online attacks. The action you just performed triggered the security solution. There are several actions that could trigger this block including submitting a certain word or phrase, a SQL command or malformed data.
You can email the site owner to let them know you were blocked. Please include what you were doing when this page came u
2026-06-26
uk.finance.yahoo.com
2026-06-26
Yahoo Finance UK
Is Applied Materials (AMAT) Quietly Rewiring Its AI Moat With New DRAM And Packaging Tools?
Sasha Jovanovic
Thu, 25 June 2026 at 8:19 pm GMT-7 3 min read
AMAT
+13.42%
In recent days, Applied Materials introduced a new epitaxy system for DRAM, plus CMP, deposition and eBeam tools aimed at advanced 3D packaging and high-bandwidth memory to support next-generation AI chips.
This push ties front-end
2026-06-26
digitimes.com
2026-06-26
SK Hynix is pairing a potentially record-scale Nasdaq ADR offering with an aggressive push to expand chip production for artificial intelligence, as the South Korean memory maker prepares to nearly double DRAM wafer input capacity by 2030–2031, The Elecreported.
2026-06-26
digitimes.com
2026-06-26
CXMT's IPO highlights the growing geopolitical fragmentation of the global semiconductor industry, strengthening China's ability to finance domestic DRAM expansion and reduce reliance on foreign capital and technology. As supply chains increasingly split along regional lines, the listing reinforces Beijing's push for memory self-sufficiency and reshapes competitive dynamics in global markets.
2026-06-25
futurumgroup.com
2026-06-25
The Futurum Group
This website or its third-party tools process personal data. You can opt out of the sale of your personal information by clicking on the “Do Not Sell or Share My Personal Information” link.
Get organization-wide instant access to market sizing and decision-maker data in a self-serve subscription model with analyst support.
Make smarter decisions with agile analyst insight and amplify your story
2026-06-25
tomshardware.com
2026-06-25
Mark Tyson
Apple has made the unprecedented decision to hike the prices of all its current computers and tablets with some entry-level model prices up as much as $500.
2026-06-25
www.manilatimes.net
2026-06-25
The Manila Times
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step-boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
www.marketscreener.com
2026-06-25
marketscreener.com
Access Denied
You don't have permission to access "http://www.marketscreener.com/news/applied-materials-introduces-new-systems-to-accelerate-dram-and-advanced-packaging-for-ai-chips-ce7f5fd8de89f521" on this server.
Reference #18.e5ab3717.1782397979.215a9cd
https://errors.edgesuite.net/18.e5ab3717.1782397979.215a9cd
2026-06-25
news.google.com
2026-06-25
Stock Titan
2026-06-25
finance.yahoo.com
2026-06-25
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Applied Materials, Inc.
Thu, June 25, 2026 at 6:00 AM PDT 6 min read
AMAT
-3.33%
Trade AMAT on Coinbase
Trading disclosure
Applied Materials, Inc.
Innovations spanning DRAM and advanced packaging enable the
2026-06-25
www.globenewswire.com
2026-06-25
GlobeNewswire
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
tomshardware.com
2026-06-25
Anton Shilov
Micron has signed 16 LTAs with various customers to supply DRAM and NAND worth $100 billion.