Oxide Removal Powder Market Growth to Accelerate by 2035 Amid Sic and Gan Device Ramp-Up - News and Statistics - IndexBox

According to IndexBox market analysis report, the oxide removal powder market is expected to accelerate growth by 2035, primarily driven by the large-scale expansion of gallium nitride (GaN) and silic... Read original →

The surge in oxide removal powder demand is a direct consequence of escalating process complexity in wide-bandgap semiconductor manufacturing. Technically, stringent surface cleanliness requirements for SiC and GaN devices are forcing upgrades in pre-CMP cleaning chemistries, accelerating innovation in high-purity ceria and colloidal silica formulations. Regulatory pressures—particularly from the EU’s Chemicals Strategy for Sustainability and U.S. EPA rules—will raise compliance costs, likely sidelining smaller material suppliers. Strategically, incumbents like Japan’s Fujimi and Cabot Microelectronics have secured positions by co-developing with Infineon and Wolfspeed, while Chinese players such as Anji Microelectronics risk exclusion from 8-inch SiC fabs without breakthroughs in particle size distribution and metallic impurity control. Over the next 12–24 months, as EV onboard chargers and 800V architectures scale, oxide removal materials will shift from auxiliary consumables to critical yield-determining components, elevating both technical barriers and pricing power.