digitimes.com
Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status se
digitimes.com
As artificial intelligence (AI) workloads place unprecedented demands on data storage systems, South Korean SSD controller designer FADU is betting that next-generation storage architecture will become a critical battleground in the AI infrastructure race.