Semiconductor News & Analysis Feed

16 articles
2026-08-03
news.samsung.com 2026-08-03
2026-08-03
news.google.com 2026-08-03
2026-08-03
news.samsung.com 2026-08-03
2026-08-03
news.samsung.com 2026-08-03
2026-07-12
news.google.com 2026-07-12
2026-07-11
www.scmp.com 2026-07-11
2026-07-11
www.scmp.com 2026-07-11
2026-06-23
www.thelec.net 2026-06-23
Samsung Electronics Chairman Lee Jae-yong recently visited the company's Cheonan campus in South Korea to inspect the C1 and C2 production lines for high-bandwidth memory (HBM). The visit aimed to assess Samsung's competitiveness and supply readiness in the HBM market, while reviewing production pla
2026-06-23
www.businesskorea.co.kr 2026-06-23
Samsung Electronics Executive Chairman Jay Y. Lee inspected the high bandwidth memory (HBM) production line at the company’s Cheonan campus, underscoring Samsung’s strategic push to lead in the AI semiconductor market. As global investment in AI accelerators and data centers intensifies, HBM has bec
2026-06-23
www.asiae.co.kr 2026-06-23
Samsung Electronics Chairman Lee Jae-Yong recently visited the Cheonan facility in South Chungcheong Province to inspect high-bandwidth memory (HBM) production lines. This move underscores Samsung's strategic focus on HBM technology amid the rapid expansion of the artificial intelligence (AI) semico
2026-06-23
www.asiae.co.kr 2026-06-23
Samsung Electronics Chairman Lee Jae-Yong recently visited the Cheonan facility in South Chungcheong Province to inspect high-bandwidth memory (HBM) production lines. This move underscores Samsung's strategic focus on the AI semiconductor market, where HBM plays a critical role. As demand for HBM su
2026-06-23
en.sedaily.com 2026-06-23
South Korean Samsung Group Vice Chairman Lee Jae-yong's first visit to Cheonan in three years to inspect HBM (High Bandwidth Memory) production lines demonstrates the South Korean government's strong commitment to semiconductor industry development. HBM technology, with its high bandwidth and low po
2026-06-10
www.moomoo.com 2026-06-10
As Moore's Law slows, advanced packaging has emerged as a critical enabler for enhancing chip integration and system performance. Glass substrates, with their low dielectric constant, low loss, high flatness, chemical stability, and thermal expansion coefficient matching silicon, are increasingly re
2026-06-05
www.ledinside.com 2026-06-05
Recently, West Lake Yanshan Technology officially launched what it claims is the world's first 8-inch GaN-on-Silicon Micro LED IDM mass production line in Deqing, Zhejiang Province. This full-chain IDM facility covers epitaxial growth, chip fabrication, and advanced packaging, enabling closed-loop p
2026-06-05
news.google.com 2026-06-05
2026-05-04
news.samsung.com 2026-05-04