Semiconductor News & Analysis Feed

Taiwan Semiconductor Manufacturing Company (TSMC) is preparing to mass-produce panel-level packaging (PLP), a next-generation chip packaging technology, setting up a direct showdown with Samsung Electronics. PLP uses large rectangular panels instead of traditional circular wafers, significantly impr

Manz Asia's successful delivery of the world's first 310mm×310mm panel-level packaging ECD (Electro-Chemical Deposition) production system represents a significant advancement in semiconductor packaging technology. This breakthrough enables larger panel sizes with enhanced precision, offering improv

ASE (Amkor Semiconductor Electronics) has launched automated 310mm panel-level packaging technology, marking a significant advancement in AI chip innovation. This breakthrough addresses the growing demand for high-performance, low-power chips in AI applications such as autonomous driving, cloud comp