Semiconductor News & Analysis Feed
18 articles
2026-07-24
www.electronicsweekly.com
2026-07-24
2026-07-01
www.indexbox.io
2026-07-01
According to IndexBox's market analysis report, the global high-end semiconductor packaging market is expected to continue growing toward 2035, primarily driven by demand for artificial intelligence and high-performance computing. This analysis reveals that as AI technology rapidly advances and data
2026-06-30
www.indexbox.io
2026-06-30
The global memory packaging market is projected to accelerate growth by 2035, driven primarily by the rapid advancement of artificial intelligence technologies and surging demand for high-bandwidth memory (HBM). This trend reflects profound technological transformation within the semiconductor indus
2026-06-27
www.digitimes.com
2026-06-27
Hanmi Semiconductor's launch of the FC Bonder 3.5 represents a strategic expansion into advanced packaging, targeting the growing AI chip market. This move demonstrates the company's shift beyond traditional thermal compression bonding equipment toward more sophisticated packaging solutions. The adv
2026-06-27
2026-06-26
en.sedaily.com
2026-06-26
Hanmi Semiconductor is targeting the AI packaging market following its dominance in HBM technology. As AI computing demands surge, the semiconductor industry is experiencing increased demand for high-performance memory and advanced packaging solutions. HBM technology, currently a core component in d
2026-06-26
en.sedaily.com
2026-06-26
Hanmi Semiconductor is aggressively targeting the AI packaging market following its dominance in HBM (High Bandwidth Memory). This strategic move reflects the semiconductor industry's shift from traditional chip manufacturing to high-value packaging technologies, driven by surging AI computing deman
2026-06-16
sg.finance.yahoo.com
2026-06-16
According to a market research report by SNS Insider, the global advanced packaging market was valued at USD 48.04 billion in 2025 and is projected to reach USD 106.71 billion by 2035, growing at a CAGR of 8.31% from 2026 to 2035. The primary driver behind this growth is the rising demand for AI acc
2026-05-18
news.futunn.com
2026-05-18
2026-05-17
www.digitimes.com
2026-05-17
2026-05-15
www.openpr.com
2026-05-15
2026-05-14
2026-05-11
www.openpr.com
2026-05-11
2026-05-09
www.thelec.net
2026-05-09
KPCA's latest report forecasts the global semiconductor packaging market to exceed $618 billion by 2026, reflecting sustained industry growth driven by increasing demand for high-performance chips in smartphones, data centers, and AI applications. Key factors include the widespread adoption of OLED
2026-05-08
theedgemalaysia.com
2026-05-08
2026-05-08
theedgemalaysia.com
2026-05-08
2026-05-08
www.klsescreener.com
2026-05-08
The Malaysian government has allocated RM185.8 million in R&D funding to five local semiconductor companies forming the Malaysia Advanced Packaging Consortium (MAPC), aiming to capture 7% of the global advanced packaging market by 2035. This initiative is part of Malaysia's broader National Semicond
2026-05-07
techwireasia.com
2026-05-07