Semiconductor News & Analysis Feed

Hanmi Semiconductor's delivery of its first FC Bonder 75 to a global customer marks a pivotal strategic inflection point for the South Korean equipment maker. Historically anchored in the HBM TC bonder niche, Hanmi has now crossed into the broader AI back-end packaging equipment space, signaling a d

Taiwan's Kaohsiung semiconductor industry is expanding into the equipment supply chain, marking a significant step in strengthening the region's role within the global semiconductor ecosystem. The Baipu Industrial Park is set to break ground in September, focusing on advanced packaging equipment, te

Applied Materials has unveiled six new semiconductor manufacturing tools targeting advanced packaging and DRAM processes to enhance yields for high-bandwidth memory (HBM) and chiplet architectures. As AI models grow in size and data throughput increases, traditional memory architectures face a 'memo