Semiconductor News & Analysis Feed
4445 articles
2026-06-18
www.storyboard18.com
2026-06-18
Storyboard18
Apple is preparing to increase prices across its product portfolio as rising memory and storage chip costs put pressure on the company's margins, Chief Executive Officer Tim Cook said in an interview with The Wall Street Journal.
The planned price increase comes as technology companies compete for limited supplies of memory components, with demand from AI-focused data centres pushing costs higher
2026-06-18
www.gadgets360.com
2026-06-18
Gadgets 360
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2026-06-18
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2026-06-18
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2026-06-18
mediaselangor.com
2026-06-18
mediaselangor.com
CUPERTINO, June 17 — Apple plans to raise prices on its products to offset increasing memory and storage chip costs, its chief executive officer Tim Cook told the Wall Street Journal (WSJ) in an interview.
A surge in artificial intelligence (AI)-driven demand for data centres has forced consumer electronics companies into a fierce competition for dwindling supplies of the key components, driving
2026-06-18
www.ndtvprofit.com
2026-06-18
NDTV Profit
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2026-06-18
www.digitimes.com
2026-06-18
digitimes
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square."...
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2026-06-18
www.mk.co.kr
2026-06-18
매일경제
Signals supply to multiple customers beyond NVIDIA Competition with Samsung over HBM4E supply heats up
사진 확대
SK hynix HBM4E 12-high new product
SK hynix said on the 18th that it had supplied samples of its 12-high HBM4E, a new ultra-high-performance DRAM product for next-generation AI, to major customers.
SK hynix said, "Based on the advanced HBM development capabilities and production know-how
2026-06-18
gulfnews.com
2026-06-18
Gulf News
Apple’s price hikes may trigger broader tech industry increases amid chip crisis
Apple Inc. plans to raise prices on its products to offset surging memory and storage chip costs, CEO Tim Cook told the Wall Street Journal, marking a rare move by the tech giant to pass semiconductor supply pressures directly to consumers amid a tightening global chip shortage.
The price increases are expected to h
2026-06-18
www.latestly.com
2026-06-18
LatestLY
Apple outgoing CEO Tim Cook has confirmed that price increases across the company's product lineup are now unavoidable due to the surging costs and tightening supply of memory and storage chips. In an interview with The Wall Street Journal, Cook explained that the situation has become unsustainable, as consumer electronics firms face fierce competition for components that are increasingly being di
2026-06-18
wccftech.com
2026-06-18
Wccftech
SK Hynix has commenced sampling of its next-gen HBM4E memory, offering up to 16 Gbps speeds and 48 GB capacities.
The acceleration in AI has pushed DRAM manufacturers to dial up their development plans. As such, SK Hynix is racing its rival Samsung to deliver the first HBM4E memory solutions to partners who will be using it to power their next-generation datacenters.
The HBM4E memory will play a
2026-06-18
letsdatascience.com
2026-06-18
Let's Data Science
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Apple Signals Price Hikes Amid Memory Chip Shortage
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June 18, 2026
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Apple plans to raise prices on its products to offset soaring memory and storage chip costs, CEO Tim Cook told The Wall Street Journal in an interview published June 17, 2026. Cook sa
2026-06-18
www.investing.com
2026-06-18
Investing.com
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2026-06-18
finance.yahoo.com
2026-06-18
Yahoo Finance
Is Applied Materials (AMAT) One of the Most Profitable American Stocks to Buy in 2026?
Sultan Khalid
Wed, June 17, 2026 at 6:13 PM PDT 3 min read
AMAT
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With a net profit margin of 29.31%, Applied Materials, Inc. (NASDAQ:AMAT) is included among the 12 Most Profitable American Stocks to Buy in 2026.
Is Applied Materials (AMAT) One of the Most Profita
2026-06-18
www.newelectronics.co.uk
2026-06-18
New Electronics
www.newelectronics.co.uk
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2026-06-18
en.yna.co.kr
2026-06-18
Yonhap News Agency
SEOUL, June 18 (Yonhap) -- SK hynix Inc. said Thursday it has begun shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, to major global customers, marking another step in the race to supply next-generation memory for artificial intelligence (AI) applications.
"The company was able to deliver samples of the 12-stack HBM4E on schedule thanks to its advanced HBM deve
2026-06-18
www.koreaherald.com
2026-06-18
The Korea Herald
SK hynix's 12-layer HBM4E, the next-generation high-bandwidth memory chip the company said Thursday it has begun shipping as samples to major customers.(SK hynix)→
SK hynix said Thursday it has shipped samples of its 12-layer HBM4E, the next generation of high-bandwidth memory for artificial intelligence, to major customers, moving the company into the customer-qualification stage roughly thr
2026-06-18
digitimes.com
2026-06-18
Taiyo Yuden is preparing to accelerate production of multilayer ceramic capacitors, or MLCCs, as AI servers and hyperscale data centers tighten supply across the global component market. But the Japanese supplier is resisting the kind of broad price increases now spreading through parts of the industry.
2026-06-18
digitimes.com
2026-06-18
SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks to strengthen its lead in high-bandwidth memory (HBM) and secure talent for the fast-changing AI semiconductor market. Industry watchers said the move reflects a greater focus on practical creativity and execution in the AI era rather than formal academic credentials.
2026-06-18
digitimes.com
2026-06-18
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMESbelieves that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP develo
2026-06-18
digitimes.com
2026-06-18
A recent open letter from the UK-based fund Palliser Capital called Taiwanese printed circuit board (PCB) maker WUS Printed Circuit one of the most undervalued AI PCB companies in the capital market. This has once drawn industry attention to the current business cooperation between WUS and its subsidiary in China, WUS Printed Circuit Kunshan.