Semiconductor News & Analysis Feed
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2026-06-25
www.bloomberg.com
2026-06-25
Bloomberg
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2026-06-25
www.businessinsider.com
2026-06-25
Business Insider
South Korea's benchmark Kospi index surged over 5% in early trading on Thursday, extending a rebound after a tech-driven selloff rattled markets around the world earlier this week.
The rally was led by heavyweight chipmakers Samsung Electronics and SK Hynix, as investors returned to battered semiconductor stocks after two days of volatility.
Samsung Electronics shares gained over 6%, while SK Hy
2026-06-25
www.upi.com
2026-06-25
upi.com
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2026-06-25
www.scmp.com
2026-06-25
South China Morning Post
Semiconductors
Tech
China’s JCET to build new plant in Shanghai to expand advanced chip packaging
US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development
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Xinmei Shen
Published: 8:30am, 25 Jun 2026
Chinese chip-packaging and testing giant Jiangsu Changjiang Electronics
2026-06-25
digitimes.com
2026-06-25
Phison Electronics CEO Khein-seng Pua said the NAND flash market is facing a supply crunch with "no end in sight," as AI continues to crowd out memory capacity and push storage demand higher.
2026-06-25
digitimes.com
2026-06-25
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the g
2026-06-25
digitimes.com
2026-06-25
Nvidia and Amazon Web Services (AWS) are expanding tools that could make it easier for companies worldwide to build and run large-scale AI systems. The changes aim to improve speed, lower costs, and reduce operational complexity across inference, search, and training, which could influence how global enterprises deploy production AI.
2026-06-25
digitimes.com
2026-06-25
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to divers
2026-06-25
digitimes.com
2026-06-25
SK Hynix said on June 24 its board approved a plan to issue new shares backing American Depositary Receipts on the Nasdaq Global Select Market, targeting up to KRW45.45 trillion (approx. US$29.43 billion) in proceeds for semiconductor facility investment.
2026-06-25
digitimes.com
2026-06-25
SK Group chairman Chey Tae-won is planning to meet Tesla and SpaceX leadership in the US at the end of June 2026 to advance cooperation on next-generation AI infrastructure, memory supply, and data-center projects, South Korean outlet Ddailyreported, citing industry sources. The meeting is expected to cover specific business collaboration plans with Tesla, SpaceX, and xAI, though the exact date wa
2026-06-25
digitimes.com
2026-06-25
Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises worldwide. The collaboration aims to simplify AI deployment across the compute continuum while enabling faster, more flexible, and more scalable hybrid AI applications.
2026-06-25
digitimes.com
2026-06-25
Micron Technology expects the global memory market to remain supply-constrained beyond 2027, driven by surging artificial intelligence demand and structural limits on new manufacturing capacity, while unveiling a new long-term supply model backed by strategic customer agreements.
2026-06-25
digitimes.com
2026-06-25
On June 24, Micron Technology reported record fiscal third-quarter results and issued a fourth-quarter forecast that significantly exceeded market expectations, reinforcing investor confidence in the AI infrastructure boom. Analysts said the company's expanding portfolio of multi-year customer agreements could help reduce the memory industry's traditional volatility, while persistent supply constr
2026-06-25
digitimes.com
2026-06-25
OpenAI on June 24 unveiled "Jalapeño," its first in-house AI accelerator, co-developed with Broadcom and manufactured by TSMC — the clearest sign yet that leading model developers want to design their own chips and broaden a supply chain long dominated by Nvidia.
2026-06-25
digitimes.com
2026-06-25
Rising demand for AI server builds is tightening the global supply of high-end MLCCs, driving steep price increases in China's electronics distribution market and exposing how quickly infrastructure demand can affect component costs worldwide. The rally underscores a structural mismatch that could keep pressure on buyers across technology supply chains for years, according to industry sources.
2026-06-25
digitimes.com
2026-06-25
At Nvidia's June 25 annual shareholder meeting, CEO Jensen Huang declared that national security "comes first" wherever it conflicts with commercial opportunity, pledging full compliance with US export controls while casting the chipmaker as a core pillar of America's AI and semiconductor industrial base.
2026-06-25
digitimes.com
2026-06-25
Global helium supply is under renewed strain. Nippon Sanso, Japan's largest industrial gas supplier, announced it will raise prices across its helium product line by an average of more than 30% starting July 2026, citing persistent tightness in global supply driven in part by rising geopolitical risks in the Middle East.
2026-06-25
digitimes.com
2026-06-25
IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan, Europe, and the US say the shortage is worse than expected, pushing packaging, testing, and related materials into broader supply constraints.
2026-06-25
semiengineering.com
2026-06-25
Brian Bailey
Engineers are flooded with new capabilities. The problem now is how best to deploy them.
2026-06-25
digitimes.com
2026-06-25
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.