Semiconductor News & Analysis Feed
4300 articles
2026-07-10
digitimes.com
2026-07-10
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging and leading-edge manufacturing equipment at the same time.
2026-07-10
digitimes.com
2026-07-10
Kioxia and SanDisk have begun shipping samples of 332-layer BiCS10 NAND, giving the Japanese memory maker a concrete technology milestone as CEO Hiroo Ota works to pull the company back toward the top of the NAND industry.
2026-07-10
digitimes.com
2026-07-10
SK Group, which hosts the annual SK AI Summit as its flagship technology event to showcase its latest AI and semiconductor developments, is reportedly postponing the 2026 edition. Originally scheduled for the second half of 2026, the event is now expected to take place in the first half of 2027. Industry sources believe the move is intended to better align the summit with Nvidia GTC, which is held
2026-07-10
digitimes.com
2026-07-10
Apple and Broadcom have extended their custom-chip partnership through 2031 under agreements expected to exceed US$30 billion, reinforcing Broadcom's position as a critical Apple chip supplier.
2026-07-10
digitimes.com
2026-07-10
E&R Engineering says AI demand and faster-than-expected glass substrate adoption are tightening equipment supply and advancing investment plans across Asia and the US. For global chip makers, the shift could accelerate next-generation packaging capacity, reshape supplier spending, and bring advanced process tools into volume production sooner than expected.
2026-07-10
digitimes.com
2026-07-10
TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.
2026-07-10
digitimes.com
2026-07-10
ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and testing, conventional backend services and AI-related applications. June revenue reached its second-highest monthly level on record, while quarterly growth exceeded the company's previous guidance.
2026-07-10
digitimes.com
2026-07-10
JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected mainstream packaging capacity while its major Chinese plants run on strong orders.
2026-07-10
digitimes.com
2026-07-10
Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening a new front in the competition over advanced memory performance, yield and supply.
2026-07-10
digitimes.com
2026-07-10
Nvidia has denied reports that its next-generation Kyber AI rack system could be delayed to 2028, saying its product roadmap remains unchanged, after SemiAnalysispointed to manufacturing challenges in a key PCB midplane as a potential bottleneck for the Rubin Ultra platform.
2026-07-10
digitimes.com
2026-07-10
China moved on July 10 to wall off its domestic supply of helium, a gas with no substitute in chipmaking and medical imaging, in a step that suggests Beijing does not expect Middle East supply risks to ease quickly — and one that could tighten an already strained global market.
2026-07-10
digitimes.com
2026-07-10
LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to expand capacity for advanced packaging products used in AI servers and high-end mobile devices.
2026-07-10
digitimes.com
2026-07-10
Meta Platforms plans to begin manufacturing its Iris AI accelerator in September 2026 while securing long-term supplies of memory, storage and optical equipment for a computing expansion expected to reach 14 gigawatts in 2027.
2026-07-10
digitimes.com
2026-07-10
As cloud service providers (CSPs) continue to ramp up capital expenditures, demand for high-speed interconnects within data centers is accelerating. Multiple research firms forecast that leading CSPs will sustain high double-digit capex growth in 2026, with roughly half of the increase driven by data center expansion.
2026-07-10
digitimes.com
2026-07-10
Chunghwa Precision Test Tech president Scott Huang said on July 7 that the company's biggest challenge over the next five years will be capacity as artificial intelligence demand surges across the semiconductor supply chain. He also urged Taiwan to increase investment in quantum technology and nuclear fusion, saying both fields could shape the island's long-term industrial future.
2026-07-10
digitimes.com
2026-07-10
Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company's advantages in common packaging optics (CPO) amid market attention on Corning's Glass Bridge technology.
2026-07-10
digitimes.com
2026-07-10
High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production costs, and long-term agreements lock up an increasing share of global DRAM capacity, according to memory industry sources.
2026-07-10
digitimes.com
2026-07-10
Micron Technology's decision to lift its planned US investment to more than US$ 250 billion through 2035, unveiled July 9 alongside the first concrete pour at its Clay, New York, site, is fundamentally a bet on where the AI era's most contested commodity, memory, will be manufactured.
2026-07-10
digitimes.com
2026-07-10
New figures from Counterpoint Research estimate that the bill of materials (BOM) for the upcoming iPhone 18 Pro Max could rise nearly US$300 compared with the iPhone 17 Pro Max released in September last year. Ballooning memory costs largely account for this increase, although Apple may be better placed than most other smartphone brands to weather such price hikes.
2026-07-10
digitimes.com
2026-07-10
GlobalWafers and Micron have signed a 10-year supply agreement, alongside US$500 million in strategic financial support, in a move that underscores how artificial intelligence (AI), high-performance computing (HPC), data centers, and advanced memory demand are reshaping semiconductor sourcing. The deal extends US supply chain localization beyond wafer production and into upstream critical material