Semiconductor News & Analysis Feed
615 articles
2026-05-29
tomshardware.com
2026-05-29
Bruno Ferreira
Call of Duty Modern Warfare 4 drops older consoles and promises extensive optimization and PC-specific options
2026-05-29
www.hpcwire.com
2026-05-29
HPCwire
www.hpcwire.com
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2026-05-28
www.pcmag.com
2026-05-28
PCMag
Since mid-2024, Qualcomm has been making waves with its Snapdragon X, X Plus, and X Elite processors, with Snapdragon X2 Elite just now hitting laptops. But the chip maker wants more of the mainstream-PC pie than ever.
Ahead of Computex 2026, the chipmaker revealed Snapdragon C, a new system-on-a-chip (SoC) processor built for budget-friendly, power-sipping laptops, slated for launch in the next
2026-05-28
tomshardware.com
2026-05-28
Paul Alcorn
Qualcomm drops Snapdragon PC range down to a lower tier.
2026-05-28
www.thurrott.com
2026-05-28
Thurrott.com
Well, that was quick: Qualcomm is expanding its Snapdragon chips for PCs with a new low-cost entry called Snapdragon C that’s designed for PCs that cost $300 and up. And it’s partnering with Acer, HP, and Lenovo to bring new PCs to market soon.
And no, “C” doesn’t stand for cheap. It stands for “Compute,” the name of the business within Qualcomm that makes its PC chips.
“As costs rise and custom
2026-05-28
asia.nikkei.com
2026-05-28
Nikkei Asia
Acer, HP and Lenovo on board for affordable laptops as component prices rise
Qualcomm's Snapdragon C Platform chips are aimed at entry-level laptops priced around $300, a bet by the U.S. chipmaker that lower-cost AI PCs will catch on. (Qualcomm)
TAIPEI -- Qualcomm Technologies is launching its first chip for budget PCs, as computer makers struggle with surging prices of CPUs and memory chips due
2026-05-28
www.phonearena.com
2026-05-28
PhoneArena
www.phonearena.com
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2026-05-28
digitimes.com
2026-05-28
Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board
2026-05-28
www.newelectronics.co.uk
2026-05-28
New Electronics
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Neil Tyler
28 May 2026
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www.ad-hoc-news.de
2026-05-28
AD HOC NEWS
Infineon’s, PCIM
Infineon’s PCIM Showcase Puts the Fuel Behind Its 100% Rally Under the Microscope
27.05.2026 - 22:10:56 | boerse-global.de
Infineon showcases SiC, GaN, and AI data center solutions at PCIM Europe amid a 106% stock surge, signaling a strategic pivot from component maker to complete energy infrastructure partner.
Infineon’s PCIM Showcase Puts the Fuel Behind Its 100% Rally Under t
2026-05-28
pcper.com
2026-05-28
PC Perspective
AFTER 20 YEARS OF SERVICE, NVIDIA IS KILLING OFF THE CONTROL PANEL
Posted by Jeremy Hellstrom | May 27, 2026 | General Tech, Graphics Cards | 0
NVIDIA1660
Source: Slashdot
SACRIFICING THE FUNCTIONAL FOR THE ‘MODERN’ ONCE AGAIN
Ars Technica did some digging and figure that we first saw NVIDIA’s Control Panel in 2006, around the time the 7x00GS/GT/GTX series were shiny and new. Tangentially, th
2026-05-28
news.google.com
2026-05-28
24/7 Wall St.
2026-05-28
news.google.com
2026-05-28
Yahoo Finance
2026-05-27
www.indexbox.io
2026-05-27
IndexBox
Thermal management has become the primary limiting factor in high-performance computing and AI accelerator packaging. Contemporary packages combine high-power ASICs with multiple High Bandwidth Memory stacks on a silicon interposer, resulting in closely linked thermal and mechanical interactions. Thermal crosstalk between dies increases HBM junction temperatures, while mismatched coefficients of t
2026-05-27
www.eenewseurope.com
2026-05-27
eeNews Europe
Infineon has expanded its CoolGaN BDS 40 V G3 bidirectional switch family with two devices for compact portable power designs. The IGK048B041S and IGK120B041S are intended for smartphones, notebooks and wearables, where board space and power-path efficiency remain tight design constraints.
For eeNews Europe readers, the update is relevant because it shows how GaN is moving further into low-voltag
2026-05-27
www.eletimes.ai
2026-05-27
ELE Times
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Infineon Exhibits Semiconductor Solutions for Power Infrastructure, AI Data Centers, Robotics, and Electromobility at PCIM Europe 2026
ELE Times News
May 27, 2026
PCIM 2026
At PCIM Europe 2026 in Nuremberg
2026-05-27
www.eqs-news.com
2026-05-27
EQS News
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2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 Deutschland - English
VOM NACHRICHTENDIENST
USI
27 Mai, 2026, 05:00 GMT
ARTIKEL TEILEN
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor pa
2026-05-27
www.thailand-business-news.com
2026-05-27
Thailand Business News
www.thailand-business-news.com
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2026-05-27
digitimes.com
2026-05-27
Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600 million (approx. US$19.10 million) at its shareholders' meeting on May 26. The company also welcomed Unimicron Technology, Gold Circuit Electronics (GCE), and Zhen Ding Technology Group (ZDT) as strategic investors.