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categories.technology MediaTek Emerges as Major Challenger in Optical Interconnect Chip Market Published: June 27, 2026 Reading Time: 2 min read Want to read in a language you're more familiar with? MediaTek enters the optical interconnect chip market with CPO technology and Micro LED optical solutions, challenging Broadcom and Marvell's duopoly in the AI data center optical chip sector. MediaT

Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the g

United Nova Technology (UNT) is expanding from automotive and industrial chips into AI server power management and optical interconnects through a CNY20 billion (US$3 billion) 12-inch mixed-signal fab project.

Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.

Marvell Technology has said its custom silicon business and data center solutions are emerging as central pillars of its long-term growth strategy, driven by rising demand from hyperscale cloud customers building AI infrastructure, including XPUs, Ethernet switching systems, and high-speed optical interconnects.

Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.

SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for short-reach AI cluster links. The collaboration could accelerate the commercialization of Micro LED co-packaged optics (CPO) technology and strengthen China's role in global AI infrastructure supply chains, according to

Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account for more than half of revenue. Despite continued uncertainty in the global environment, Peng remains cautiously optimistic about the second half of 2026 and expects the company to maintain relatively strong performa

As artificial intelligence workloads continue to expand, demand for memory capacity and bandwidth is growing rapidly, pushing existing GPU-HBM architectures toward their limits. According to ZDNet, researchers at a major South Korean memory manufacturer stated that memory and packaging companies are exploring a new approach that places the GPU and HBM in separate packages. Unlike traditional desig

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