Semiconductor News & Analysis Feed
5892 articles
2026-05-27
finance.yahoo.com
2026-05-27
Yahoo Finance
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2026-05-27
ca.finance.yahoo.com
2026-05-27
Yahoo! Finance Canada
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2026-05-27
www.trendforce.com
2026-05-27
TrendForce
[News] Infineon Announces Second 2026 Price Hike Effective July 1 Amid Rising Supply Chain Costs, Strong Demand
2026-05-27 Semiconductors editor
News
Please note that this article cites information from TechNews and Commercial Times.
Infineon has announced another price increase. According to TechNews, the company informed customers and partners on the 26th that it will adjust prices for
2026-05-27
www.taiwannews.com.tw
2026-05-27
Taiwan News
Net Income Up YoY Despite Revenue Decline
2026Q1 Revenue Mix by Process Node
Alchip Technologies reported that 21% of its first quarter 2026 revenue came from emerging business at the 3nm/2nm technology node, reflecting the company’s advanced technology leadership.
Taipei, Taiwan, May 27, 2026 (GLOBE NEWSWIRE) -- Alchip Technologies reported slight year-over-year net income growth i
2026-05-27
www.cnbc.com
2026-05-27
CNBC
Nvidia
is expanding heavily in Taiwan with a new campus and a tenfold increase in annual spending, CEO Jensen Huang announced Wednesday, as the chipmaker plans for artificial intelligence-powered growth.
Taiwan’s Taiex stock index climbed 1.7% to a record close on Wednesday. Also helping gains was news that South Korea’s SK Hynix and U.S.-based Micron
became the latest chip-related companies to
2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
finance.yahoo.com
2026-05-27
Yahoo Finance
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2026-05-27
sammyguru.com
2026-05-27
SammyGuru
Samsung may launch a Physical AI chiplet platform next year in collaboration with Cadence. The platform could support applications like robotics, autonomous driving, and industrial automation. It is being developed using the Korean foundry’s SF5A (5nm) process technology.
In January 2026, Samsung and Cadence announced a partnership to develop a chiplet-based Physical AI semiconductor platform. Un
2026-05-27
www.marketscreener.com
2026-05-27
marketscreener.com
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Reference #18.49102017.1779872430.efc3d8b9
https://errors.edgesuite.net/18.49102017.1779872430.efc3d8b9
2026-05-27
en.sedaily.com
2026-05-27
Seoul Economic Daily
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2026-05-27
www.ad-hoc-news.de
2026-05-27
AD HOC NEWS
Cadence Design Systems, US12541W1027
Cadence Design Systems stock (US12541W1027): Wells Fargo lifts target after strong AI design demand
27.05.2026 - 10:45:37 | ad-hoc-news.de
Wells Fargo has raised its price target for Cadence Design Systems to USD 425 per share while maintaining an Overweight rating, highlighting continued demand for the companys AI-driven design software and services. The move
2026-05-27
www.digitimes.com
2026-05-27
digitimes
TSMC chairman and CEO C.C. Wei personally addressed employees at a company-wide meeting on the morning of May 27, making a direct commitment on bonuses after days of backlash over reports of a 15% cut.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the '
2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
www.kedglobal.com
2026-05-27
KED Global
Samsung, SK Hynix jump as Korea’s first single-stock leverage ETFs debut
Samsung Electronics Co. and SK Hynix Inc. rallied on Wednesday as South Korea’s first leverage and inverse exchange-traded funds tracking individual stocks made their market debut, giving investors a new way to amplify bets on the country’s two dominant memory chip makers.Samsung E
2026-05-27
finance.yahoo.com
2026-05-27
Yahoo Finance
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2026-05-27
eetimes.com
2026-05-27
We now know what China’s been working on to counter U.S. sanctions on EUV technology.
2026-05-27
semiengineering.com
2026-05-27
Semiconductor Engineering
Combining manufacturing-resolution geometry with deterministic, solver-accurate computation changes the economics of thermal analysis for advanced 2.5D packages.
Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging.
Modern packages integrate high-power ASICs with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer,
2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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