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SK Group, TSMC Agree to Strengthen Ties in HBM, Advanced Packaging
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2026/06/04 09:36 CST
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SK Group Chairman Chey Tae-won met with Taiwan Semiconductor Manufac
2026-06-04
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2026-06-04
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SK Group Chairman Chey Tae-won met with Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) Chairman C.C. Wei. The two sides exchanged views on the development of next-generation AI technologies and agreed to further strengthen comprehensive cooperation, including joint research and development of next-generation high bandwidth memory (HBM) and advanced packaging technologies, in order t
2026-06-04
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Liz Allan
Time-sensitive networking and MACsec allow Auto Ethernet to handle safety-critical func...
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Huawei's recently proposed Tau Law has drawn attention across the semiconductor industry, with the company arguing that chip performance can be improved by reducing the internal signal transmission time constant, known as τ, through multi-layer optimization...
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Anthropic’s Mythos Is a Security Powerhouse. It’s Also a Budget Buster
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2026-06-04
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Super Micro Computer launched its rack-scale Helios platform at Computex 2026, built on Advanced Micro Devices’ (NASDAQ: AMD) Instinct MI455X GPUs and EPYC CPUs.
The Helios platform targets hyperscale AI infrastructure designed for large language model training, inference, and broader AI workloads at scale.
White House launches UFO-themed Aliens.gov: An ICE arrest tracker
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2026-06-04
InchFab's mini fabs are cost-competitive with larger 8-inch wafer fabs at the half-micron and larger nodes.
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