Semiconductor News & Analysis Feed

Taiwan Semiconductor Manufacturing Company (TSMC) is accelerating its global expansion of 3-nanometer FinFET (N3) capacity to meet surging demand for artificial intelligence (AI) applications. This initiative includes new 3nm fabs in Tainan, Taiwan, and Arizona, with Japan set to follow by 2028. TSM

Floadia has introduced its latest automotive eFlash IP, the G1, built on TSMC's 180BCD Gen3 process platform. Designed to meet the demanding reliability and performance requirements of next-generation automotive applications, the solution features a 256KB program flash macro and a 1KB data flash mac

NVIDIA CEO Jensen Huang revealed at Computex 2026 that the company is already planning the next generation of RTX Spark chips, including N2X and N3X, with the ultimate goal of creating a Star Trek-like computing experience. Huang used the iconic Star Trek scene where Scotty mistakes a mouse for a mi