Semiconductor News & Analysis Feed
16 articles
2026-08-21
www.eteknix.com
2026-08-21
2026-08-20
2026-08-17
www.vanguardngr.com
2026-08-17
Nigerian semiconductor company HBM reported a remarkable 57% profit increase to N208 billion in H1 2026, demonstrating the improving trajectory of Nigeria's semiconductor industry and the company's enhanced market competitiveness. This financial performance reflects broader trends in Africa's techno
2026-08-13
hothardware.com
2026-08-13
2026-08-13
www.tomshardware.com
2026-08-13
Qualcomm has unveiled detailed specifications for its Snapdragon C system-on-chip (SoC), targeting budget laptops priced around $300. The 8-core ARM-based Kryo CPU features a maximum single-core frequency of 3.0 GHz and a multi-core frequency of 2.0 GHz, with integrated Adreno GPU and Hexagon NPU. Q
2026-08-04
www.techpowerup.com
2026-08-04
2026-08-03
tech-insider.org
2026-08-03
2026-07-22
en.macromicro.me
2026-07-22
Taiwan Semiconductor Manufacturing Company (TSMC) continues to intensify its investment in the artificial intelligence sector, with the introduction of its N2 process technology marking a significant advancement in semiconductor manufacturing. As AI computing demand surges, TSMC's substantial capita
2026-07-15
www.odaily.news
2026-07-15
2026-06-21
wccftech.com
2026-06-21
Despite Samsung's advancements in advanced lithography, the upcoming Exynos 2700 faces competitive pressure from TSMC's 2nm N2P process. Although Samsung's 2nm GAA process is progressing, rumors suggest it lags behind TSMC’s in terms of Power, Performance, and Area (PPA) metrics. To compensate, Sams
2026-06-19
wccftech.com
2026-06-19
Apple's upcoming A21 Pro chip is expected to exclusively utilize TSMC's enhanced 2nm N2P process, marking a significant development in the semiconductor industry. While Qualcomm and MediaTek have already adopted this advanced 2nm process for their upcoming products, Apple plans to match competitor c
2026-06-19
wccftech.com
2026-06-19
According to Wccftech, Apple is reportedly planning to exclusively use TSMC's enhanced 2nm 'N2P' process for the upcoming A21 Pro chip in 2026, while the standard A21 version will continue using the older 2nm N2 node. This decision is driven by cost control and profit pressures, as rising wafer cost
2026-06-16
www.ad-hoc-news.de
2026-06-16
Suess Microtec has launched its new XBC300 Gen2 wafer bonder to meet the rising demand in advanced packaging and 3D integration. Designed for high-volume semiconductor production rather than lab-scale tools, the device targets applications such as fan-out packaging, 3D integration, and heterogeneous
2026-06-10
www.tomshardware.com
2026-06-10
TSMC is launching an unprecedented capacity expansion plan to meet surging demand for AI processors, advanced logic chips, and advanced packaging technologies. Over the past decade, the company has invested nearly $240 billion in capacity expansion, now operating nine sites with dozens of 300mm fabs
2026-06-08
finance.yahoo.com
2026-06-08
Silvaco Group Inc. (NASDAQ: SVCO) has launched the industry’s first MIPI C-PHY/D-PHY combo IP on TSMC’s N2P process, supporting MIPI D-PHY v3.6 with embedded clock mode (ECM). This innovation delivers significant improvements in power efficiency, area usage, and EMI performance. Designed for space-c
2026-06-04
www.theverge.com
2026-06-04
NVIDIA CEO Jensen Huang revealed at Computex 2026 that the company is already planning the next generation of RTX Spark chips, including N2X and N3X, with the ultimate goal of creating a Star Trek-like computing experience. Huang used the iconic Star Trek scene where Scotty mistakes a mouse for a mi