Semiconductor News & Analysis Feed

5 articles
2026-06-25
tomshardware.com 2026-06-25 Anton Shilov
Qualcomm unveils HBC near-memory AI architecture, claims it has broken the memory wall.
2026-06-25
wccftech.com 2026-06-25 Wccftech
Qualcomm is unveiling its breakthrough for the AI data center market called HBC (High-Bandwidth Compute), to break the memory wall. At its Investors Day 2026, Qualcomm unveiled HBC under its Dragonfly brand, an innovative technology that aims to offer a major boost in memory capacity and bandwidth. The HBC architecture deploys a purpose-built & near-memory solution that bonds compute with boosted
2026-06-16
eetimes.com 2026-06-16
AMD acquires MEXT to slash AI memory costs and break the memory wall.
2026-06-10
eetimes.com 2026-06-10
As AI models scale to trillions of parameters, conventional memory architectures face mounting capacity and efficiency constraints.
2026-05-11
eetimes.com 2026-05-11 Brett Cline
The DRAM crunch is real—secure your AI product roadmap now with memory compression or risk falling behind.