Semiconductor News & Analysis Feed
743 articles
2026-07-07
digitimes.com
2026-07-07
While there are still years to go for the commercialization of 6G adoption, the next-generation mobile network architecture is increasingly poised to take shape.
2026-07-07
www.digitimes.com
2026-07-07
digitimes
While there are still years to go for the commercialization of 6G adoption, the next-generation mobile network architecture is increasingly poised to take shape.
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2026-07-07
eetimes.com
2026-07-07
Canada has the AI talent. Now, it’s time to scale their domestic compute and sovereign hardware.
2026-07-07
finance.yahoo.com
2026-07-07
Yahoo Finance
Can NVIDIA’s (NVDA) New Indonesia AI Campus Deal Unlock $30 Billion for a Partner?
Abdul Rahman
Mon, July 6, 2026 at 12:45 PM PDT 2 min read
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2026-07-06
news.google.com
2026-07-06
Investor's Business Daily
2026-07-06
news.google.com
2026-07-06
Yahoo! Finance Canada
2026-07-06
news.google.com
2026-07-06
Yahoo Finance
2026-07-06
digitimes.com
2026-07-06
Huawei's semiconductor chief is promoting a post-Moore roadmap that shifts industry focus from shrinking transistors to reducing time across the computing stack, a framework backed by internal production claims for Kirin chips and Ascend accelerators. Despite that, he also drew caution because the work remains a preprint, not a peer-reviewed study.
2026-07-06
digitimes.com
2026-07-06
As physical AI and robotics spread globally, NXP CEO Rafael Sotomayor said robots will only reach commercial scale if they can think and act independently. For international industries, that shift could determine whether factory automation, humanoids, and smart machines become practical tools or remain costly demonstrations.
2026-07-06
digitimes.com
2026-07-06
China's IC design industry is nearing CNY1 trillion (approx. US$150 billion) ahead of schedule, but AI is exposing deeper gaps in computing architecture, high-end talent, and ecosystem control.
2026-07-06
digitimes.com
2026-07-06
Zhonghao Xinying (Hangzhou) Technology has launched its new self-developed high-performance TPU AI processor, Xuyu, alongside Taize 2.0, a software-hardware integrated AI computing platform built around the chip.
2026-07-06
digitimes.com
2026-07-06
SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.
2026-07-06
digitimes.com
2026-07-06
Rising demand for AI servers and high-performance computing (HPC) continues to drive price increases across the upstream PCB materials supply chain.
2026-07-06
news.google.com
2026-07-06
ServeTheHome
2026-07-06
news.google.com
2026-07-06
ServeTheHome
2026-07-05
digitimes.com
2026-07-05
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth me
2026-07-05
digitimes.com
2026-07-05
Advantest said it has partnered with OpenLight to develop a scalable silicon photonics (SiPh) test solution for mass production environments. The announcement comes as artificial intelligence (AI) and high-performance computing workloads increase demand for silicon photonics and co-packaged optics in data centers.
2026-07-05
news.google.com
2026-07-05
IndexBox
2026-07-05
news.google.com
2026-07-05
GuruFocus
2026-07-04
digitimes.com
2026-07-04
Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for the semiconductor and PCB inspection equipment maker. The company said the biggest challenge has now shifted from winning orders to managing supply chains and expanding capacity.