121 articles
2026-05-13
www.fastcompany.com
2026-05-13
Fast Company
__fail__
2026-05-13
www.msn.com
2026-05-13
MSN
__fail__
2026-05-13
www.detroitnews.com
2026-05-13
The Detroit News
__fail__
2026-05-13
www.euronews.com
2026-05-13
Euronews.com
__fail__
2026-05-13
coincentral.com
2026-05-13
CoinCentral
__fail__
2026-05-13
digitimes.com
2026-05-13
The US may soon see Taiwan-style industrial parks, according to officials and industry representatives who recently visited the country to attend a trade summit. The development could see companies in Taiwan's chip ecosystem establish a presence at US locations near TSMC's facilities.
2026-05-13
digitimes.com
2026-05-13
South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second half of 2026, with the systems expected to be used in the mass production of networking chips for SpaceX.
2026-05-12
tomshardware.com
2026-05-12
Luke James
Amazon is the latest hyperscaler where employees have been caught inflating AI token consumption to hit internal usage targets.
2026-05-12
pr.tsmc.com
2026-05-12
Taiwan Semiconductor
enzh-hantzh-hansja
2026-05-12
www.electronicsforyou.biz
2026-05-12
Electronics For You BUSINESS
__fail__
2026-05-12
sourceability.com
2026-05-12
Sourceability
__fail__
2026-05-12
digitimes.com
2026-05-12
TSMC is facing fierce customer competition and supply shortages as demand surges for artificial intelligence and high-performance computing chips, forcing fabless chipmakers to consider limited shifts in manufacturing partners to ease constraints.
2026-05-12
digitimes.com
2026-05-12
Ahead of the expected Trump-Xi summit in Beijing, the US and China are first holding preparatory talks in South Korea, placing trade, technology, and semiconductor export controls at the center of the negotiation track.
2026-05-12
semiengineering.com
2026-05-12
Gregory Haley
Increasing complexity is limiting the ability of machine learning models to effectively...
2026-05-11
www.barrons.com
2026-05-11
Barron's
__fail__
2026-05-11
www.marketbeat.com
2026-05-11
MarketBeat
__fail__
2026-05-11
www.marketbeat.com
2026-05-11
MarketBeat
__fail__
2026-05-11
theaiinsider.tech
2026-05-11
AI Insider
__fail__
2026-05-11
digitimes.com
2026-05-11
Micron's senior vice president, Jeremy Werner, told The Circuit Podcast that memory has become a strategic bottleneck for data-center inference, warning that insufficient memory can sharply cut GPU utilization while faster, larger memory can theoretically multiply the compute extracted from GPUs. The remarks underscore how storage and memory design could limit AI deployment.
2026-05-10
tomshardware.com
2026-05-10
Etiido Uko
MIT researchers have developed a 3D-printed three-sided zipper that rapidly transforms floppy structures into rigid beams, robotic limbs, and deployable frameworks using triangular geometry.