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Asahi Kasei Launches Photosensitive Film for Advanced Packaging
The company combines photosensitive polyimide and dry film photoresist technologies to create innovative film for panel-level semiconductor packaging applications.
David Hutton
May 22, 2026
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What if hardware adapted itself to your code instead of forcing developers to optimize for the hardware? In this episode of AI with Sally, Sally Ward-Foxton speaks with NextSilicon CEO Elad Raz about the company’s radically different approach to compute architecture: a runtime-reconfigurable processor designed to optimize itself while applications are running.
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