Semiconductor News & Analysis Feed

7 articles

2026-07-15

Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV

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tomshardware.com 2026-07-15 Etiido Uko

Intel is using ASML’s High-NA EUV tools to pattern select Panther Lake layers, marking the technology’s first use in high-volume logic production

Semiconductor Manufacturing EUV Lithography Intel ASML High NA EUV Chip Process Node Logic Chips Manufacturing Process

2026-07-15

Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV — select Panther Lake layers on 18A are now dual-qualified for 0.55 NA scanners - Tom's Hardware

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www.tomshardware.com 2026-07-15 Tom's Hardware

2026-07-15

ASML Raises Full-Year Guidance as Intel Ships First High-NA EUV Logic Chip - Tech Times

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www.techtimes.com 2026-07-15 Tech Times

2026-07-15

Intel Leads Foundry Race With First High-NA EUV Logic Chip in Mass Production - Tech Times

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www.techtimes.com 2026-07-15 Tech Times

2026-07-14

Samsung brings HBM, logic, and optics together in packaging push

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digitimes.com 2026-07-14

Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.

2026-07-13

5-Pack Texas Instruments 74LS181N Logic Chips - 24-Pin DIP Pulls From Working Boards - santoandre.biz

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news.google.com 2026-07-13 santoandre.biz

2026-05-11

SK Hynix and Intel team up on 2.5D packaging to connect HBM with logic chips - Crypto Briefing

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cryptobriefing.com 2026-05-11 Crypto Briefing

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